DOI:10.16157/j.issn.0258-7998.2016.06.001
Author:Tian Ze1,2,Suo Gaohua3,Liu Yufeng4,Li Kai3
Author Affilications:1.AVIC Computing Technique Research Institute,Xi′an 710068,China; 2.Aviation Key Laboratory of Science and Technology on Integrated Circuit and Micro-System Design,Xi′an 710068,China; 3.Xi′an Xiangteng Microelectronics Technology CO.,LTD,Xi′an 710068,China; 4.Beijing Keeven Aviation Instrument CO.,LTD,Beijing 100086,China
DOI:10.16157/j.issn.0258-7998.2016.06.002
Author:Yang Feng1,2,Chen Wei3,Wang Xuanming1,2,Yang Qingke3
Author Affilications:1.AVIC Computing Technique Research Institute,Xi′an 710068,China; 2.Aviation Key Laboratory of Science and Technology on Integrated Circuit and Micro-System Design,Xi′an 710068,China; 3.Xi′an Xiangteng Microelectronics Technology CO.,LTD,Xi′an 710068,China
DOI:10.16157/j.issn.0258-7998.2016.06.003
Author:Cai Yefang1,2,Zhang Yaqi3,Niu Shaoping1,2,Xia Jie3
Author Affilications:1.AVIC Computing Technique Research Institute,Xi′an 710068,China; 2.Aviation Key Laboratory of Science and Technology on Integrated Circuit and Micro-System Design,Xi′an 710068,China; 3.Xi′an Xiangteng Microelectronics Technology CO.,LTD,Xi′an 710068,China
DOI:10.16157/j.issn.0258-7998.2016.06.004
Author:Zhao Bin1,2,Yi Ningning3,Zheng Fei1,2,Wei Yanyan1,2
Author Affilications:1.AVIC Computing Technique Research Institute,Xi′an 710068,China; 2.Aviation Key Laboratory of Science and Technology on Integrated Circuit and Micro-System Design,Xi′an 710068,China; 3.Xi′an Xiangteng Microelectronics Technology CO.,LTD,Xi′an 710068,China
DOI:10.16157/j.issn.0258-7998.2016.06.005
Author:Xin Yongli1,2,Jin Weiping3,Jia Zhao3,Chen Feiru3
Author Affilications:1.AVIC Computing Technique Research Institute,Xi′an 710068,China; 2.Aviation Key Laboratory of Science and Technology on Integrated Circuit and Micro-System Design,Xi′an 710068,China; 3.Xi′an Xiangteng Microelectronics Technology CO.,LTD,Xi′an 710068,China
DOI:10.16157/j.issn.0258-7998.2016.06.006
Author:Zhang Ling1,2,Tian Ruilong3,Yang Chengli3,Wang Huan3
Author Affilications:1.AVIC Computing Technique Research Institute,Xi′an 710068,China; 2.Aviation Key Laboratory of Science and Technology on Integrated Circuit and Micro-System Design,Xi′an 710068,China; 3.Xi′an Xiangteng Microelectronics Technology CO.,LTD,Xi′an 710068,China
DOI:10.16157/j.issn.0258-7998.2016.06.007
Author:Liu Qinglong1,2,Dong Jiashan2
Author Affilications:1.School of Electronic and Information Engineering,South China University of Technology,Guangzhou 510640,China; 2.Guangzhou Haige Communications Group Incorporated Company,Guangzhou 510663,China
DOI:10.16157/j.issn.0258-7998.2016.06.008
Author:Ke Qiang1,2,Liu Xin1,2,Liu Yu1,2,Wang Xiaosong1,2,Zhang Haiying1,2
Author Affilications:1.Institute of Microelectronics of Chinese Academy of Sciences,Beijing 100029,China; 2.Beijing Key Laboratory of Radio Frequency IC Technology for Next Generation Communications,Beijing 100029,China
DOI:10.16157/j.issn.0258-7998.2016.06.009
Author:Zhang Liang,Wang Jingcun,Mei Biao
Author Affilications:College of Information Science and Engineering,Wuhan University of Science and Technology,Wuhan 430081,China
DOI:10.16157/j.issn.0258-7998.2016.06.010
Author:Huang Haisheng,Jing Genping,Li Xin,Chen Shunzhou
Author Affilications:School of Electronic Engineering,Xi′an University of Posts and Telecommunications,Xi′an 710121,China
DOI:10.16157/j.issn.0258-7998.2016.06.011
Author:Zhao Wen1,Yin Junjian1,Zhao Dongliang1,2
Author Affilications:1.Institute of Microelectronics of Chinese Academy of Sciences,Beijing 100029,China; 2.School of Physics and Microelectronics,Hunan University,Changsha 250100,China
DOI:10.16157/j.issn.0258-7998.2016.06.012
Author:Huang Shifeng1,Chen Zhangyou1,Zhang Lan1,2,Yue Xianchang1,2
Author Affilications:1.School of Electronics and Information,Wuhan University,Wuhan 430072,China; 2.Collaborative Innovation Center of Geospatial Technology,Wuhan 430079,China
DOI:10.16157/j.issn.0258-7998.2016.06.013
Author:Wang Liangliang1,2,Yang Yuan1,Gao Yong1,2,Wen Yang1,2,Ma Li1
Author Affilications:1.Department of Electronics Engineering,Xi′an University of Technology,Xi′an 710048,China; 2.Department of Electronics & Information,Xi′an Polytechnic University,Xi′an 710048,China
DOI:10.16157/j.issn.0258-7998.2016.06.014
Author:Wang Hai,Zhang Lichao,Zhou Weiguang
Author Affilications:College of Materials Science and Engineering,Huazhong University of Science and Technology,Wuhan 430074,China
DOI:10.16157/j.issn.0258-7998.2016.06.015
Author:Pan Bitao,Nie Xiaolong,Wang Zuqiang
Author Affilications:School of Information Science and Engineering,Shandong University,Jinan 250100,China
DOI:10.16157/j.issn.0258-7998.2016.06.016
Author:Han Deqiang,Yang Liping,Wang Zongxia
Author Affilications:College of Computer,Beijing University of Technology,Beijing 100124,China
DOI:10.16157/j.issn.0258-7998.2016.06.017
Author:Zhou Jingdong,Shen Piaohai,Wang Lei
Author Affilications:Research and Design Institute of Agricultural Mechanical Engineering,Hubei University of Technology,Wuhan 430068,China
DOI:10.16157/j.issn.0258-7998.2016.06.018
Author:Bai Shuang,Huang Junzeng,Shi Chun,Wu Gang
Author Affilications:Institute of Industrial Automation,Department of Automation,University of Science and Technology of China,Hefei 230022,China
DOI:10.16157/j.issn.0258-7998.2016.06.019
Author:Wu Kaibin,Chen Lan,Lv Chao
Author Affilications:Institute of Microelectronics,Chinese Academy of Sciences,Beijing 100029,China
DOI:10.16157/j.issn.0258-7998.2016.06.020
Author:Xu Hu1,2,Lin Yihui1,2,Liu Xiaogang1,2
Author Affilications:1.The 41st Research Institute of CETC,Bengbu 233010,China; 2.Anhui Province Key Laboratory of Electronic Measurement Technology,Bengbu 233010,China
DOI:10.16157/j.issn.0258-7998.2016.06.021
Author:Jin Hui,Luo Min,Liu Zong
Author Affilications:Science and Technology on High Power Microwave Laboratory,Institute of Applied Electronics,CAEP,Mianyang 621900,China
DOI:10.16157/j.issn.0258-7998.2016.06.022
Author:Zhang Meiling1,Hu Xiao2
Author Affilications:1.College of Information and Electrical Engineering,China University of Mining and Technology,Xuzhou 221116,China; 2.College of Mechanical and Electrical Engineering,China University of Mining and Technology,Xuzhou 221116,China
DOI:10.16157/j.issn.0258-7998.2016.06.023
Author:Pei Chenglong,Wei Zhipeng,Yang Liang
Author Affilications:School of Information Science and Engineering,Shenyang University of Technology,Shenyang 110870,China
DOI:10.16157/j.issn.0258-7998.2016.06.024
Author:Quan Shengrong,Zhang Tianqi,Wang Junxia,Ma Baoze
Author Affilications:Chongqing Key Laboratory of Signal and Information Processing,Chongqing University of Posts and Telecommunications, Chongqing 400065,China
DOI:10.16157/j.issn.0258-7998.2016.06.025
Author:Wang Zihao,Yang Xiaojian
Author Affilications:School of Computer Science and Technology,University of Nanjing Technology University,Nanjing 211816,China
DOI:10.16157/j.issn.0258-7998.2016.06.026
Author:Tao Xiaoling1,2,Wu Xin2,Kang Ruinan2
Author Affilications:1.Guangxi Colleges and Universities Key Laboratory of Cloud Computing and Complex Systems, Guilin University of Electronic Technology,Guilin 541004,China; 2.School of Information and Communication,Guilin University of Electronic Technology,Guilin 541004,China
DOI:10.16157/j.issn.0258-7998.2016.06.027
Author:Liu Wei1,Hu Anlin2
Author Affilications:1.Tianhua College,Shanghai Normal University,Shanghai 201815,China; 2.Shanghai Gongjin Electronics Limited Company,Shanghai 200233,China
DOI:10.16157/j.issn.0258-7998.2016.06.028
Author:Zheng Jingyi1,Gao Shaoquan1,Jiang Hanjun1,Zhang Chun1,Wang Zhihua1,2,Jia Wen2
Author Affilications:1.Institute of Microelectronics,Tsinghua University,Beijing 100084,China; 2.Research Institute of Tsinghua at Shenzhen,Shenzhen 518055,China
DOI:10.16157/j.issn.0258-7998.2016.06.029
Author:Liu Meirui
Author Affilications:No.10 Institute of China Electronics Technology Group Corporation,Chengdu 610036,China
DOI:10.16157/j.issn.0258-7998.2016.06.030
Author:Zhu Xiaomei1,Huang Ying1,Bao Yaping1,Gui Guan2
Author Affilications:1.College of Computer Science and Technology,Nanjing Tech University,Nanjing 211816,China; 2.Institute of Signal Processing and Transmission,Nanjing University of Posts and Telecommunications,Nanjing 210003,China
DOI:10.16157/j.issn.0258-7998.2016.06.031
Author:Li Kun1,Liu Tao2,Wang Yongjian3,Jiang Hong1
Author Affilications:1.School of Information Engineering,Southwest University of Science and Technology,Mianyang 621010,China; 2.College of Geophysis and Information Engineering,China University of Petroleum-Beijing,Beijing 102249,China; 3.National Computer Network and Information Security Management Center,Beijing 100031,China
DOI:10.16157/j.issn.0258-7998.2016.06.032
Author:Wang Keli1,Wu Shuhong1,Wang Yaoli2
Author Affilications:1.College of Computer Science and Technology,Taiyuan University of Technology,Taiyuan 030024,China; 2.College of Information Engineering,Taiyuan University of Technology,Taiyuan 030024,China
DOI:10.16157/j.issn.0258-7998.2016.06.033
Author:Wang Hao1,Han Min1,Dong Jie2
Author Affilications:1.Faculty of Electronic Information and Electrical Engineering,Dalian University of Technology,Dalian 116024,China; 2.School of Information Science and Engineering,Dalian Polytechnic University,Dalian 116034,China
DOI:10.16157/j.issn.0258-7998.2016.06.034
Author:Yan Yunhua1,Lv Qianyong2,Qin Na2
Author Affilications:1.Changzhou Institute of Mechatronic Technology,Changzhou 213164,China; 2.School of Electrical Engineering,Southwest Jiaotong University,Chengdu 610031,China
DOI:10.16157/j.issn.0258-7998.2016.06.035
Author:Lang Bo,Fan Yina,Huang Jing,Wang Peng
Author Affilications:School of Information Technology,Beijing Normal university Zhuhai,Zhuhai 519087,China
DOI:10.16157/j.issn.0258-7998.2016.06.036
Author:Zhang Meng1,2,Lin Min1,Cheng Xinhong1,Li Xinchang1,2,Wu Zhonghao1
Author Affilications:1.Shanghai Institute of Micro-System and Information Technology,Chinese Academy of Science,Shanghai 200050,China; 2.University of Chinese Academy of Sciences,Beijing 100049,China
DOI:10.16157/j.issn.0258-7998.2016.06.037
Author:Yang Jun,Li Xiaoning,Li Junlong,Zhang Wenrui
Author Affilications:University of Electronic Science and Technology of China,Chengdu 611731,China
DOI:10.16157/j.issn.0258-7998.2016.06.038
Author:Hu Kaimin,Wan Heng,Zou Yuanwei,Jin Jing
Author Affilications:School of Electrical and Electronic Engineering,Shanghai Institute of Technology,Shanghai 201418,China
DOI:10.16157/j.issn.0258-7998.2016.06.039
Author:Zhuang Li,Zhang Jun,Dong Jiannian
Author Affilications:School of Energy and Power Engineering,Nanjing University of Science and Technology,Nanjing 210094,China
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