DOI:10.16157/j.issn.0258-7998.2016.08.001
Author:Hao Caiyong1,Luo Chao2,Liu Heng1
Author Affilications:1.Shenzhen Station of State Radio Monitoring Center,Shenzhen 518120,China; 2.State Radio Monitoring Center,Beijing 100037,China
DOI:10.16157/j.issn.0258-7998.2016.08.002
Author:Huang Jiarong1,2,Ye Xiaojing2
Author Affilications:1.The Fifth Electronics Research Institute of Ministry of Industry and Information Technology,Guangzhou 510610,China; 2.School of Physics and Optoelectronics,South China University of Technology,Guangzhou 510640,China
DOI:10.16157/j.issn.0258-7998.2016.08.003
Author:Ge Zhe,Wang Zhihong,Li Yuanyue
Author Affilications:NXP Semiconductor,Suzhou 215000,China
DOI:10.16157/j.issn.0258-7998.2016.08.004
Author:Cai Yan,Ji Hao,Shi Jian′an
Author Affilications:NVIDIA,Shanghai 201210,China
DOI:10.16157/j.issn.0258-7998.2016.08.005
Author:Wang Chao1,Liu Huanyan2
Author Affilications:1.Spreadtrum,Shanghai 201203,China;2.Cadence,Shanghai 201204,China
DOI:10.16157/j.issn.0258-7998.2016.08.006
Author:Wu Jun1,Chen Deheng1,Zhuang Zhemin2
Author Affilications:1.Shenzhen Edadoc Technology CO.,LTD,Shenzhen 518057,China; 2.Cadence Design System Shenzhen Branch,Shenzhen 518000,China
DOI:10.16157/j.issn.0258-7998.2016.08.007
Author:Lin Hui1,Jiang Wu1,Xiong Xi1,Li Yuanzhu2,Huang Zhirong3
Author Affilications:1.HiSilicon Technologies,Shenzhen 518129,China;2.Cadence Design System,Shenzhen 518129,China; 3.Soft International Science and Technology,Shenzhen 518129,China
DOI:10.16157/j.issn.0258-7998.2016.08.008
Author:Sun Fengjun1,Li Wenqiang1,Chen Siruo2
Author Affilications:1.Beijing Spreadtrum High-Tech Communication Technology Co.,LTD,Beijing 100190,China; 2.Cadence,Beijing 100100,China
DOI:10.16157/j.issn.0258-7998.2016.08.009
Author: Shen Zhiyuan1,Wu Zhi1,Chen Guosheng1,Hu Jinsong2
Author Affilications:1.Lattice Semiconductor,Shanghai 200233,China;2.Cadence,Shanghai 201024,China
DOI:10.16157/j.issn.0258-7998.2016.08.010
Author:Zhang Haibo
Author Affilications:Shenzhen Zhong Xing Microelectronics Co.,Ltd,Shenzhen 518055,China
DOI:10.16157/j.issn.0258-7998.2016.08.011
Author:Xu Guhan1,Yan Wei1,Zhu Zhaowei2,Zheng Yongli2
Author Affilications:1.School of Software & Microelectronics,Peking University,Beijing 100871,China; 2.Alchip Technologies(Wuxi) Ltd,Wuxi 214000,China
DOI:10.16157/j.issn.0258-7998.2016.08.012
Author:Chen Hongna,Li Zhigang,Mei Shuang,Tian Sheng
Author Affilications:College of Electrical Engineering,Hebei University of Technology,Tianjin 300130,China
DOI:10.16157/j.issn.0258-7998.2016.08.013
Author:Zeng Wenyi,Yang Hao,Dai Zhiwei
Author Affilications:Institute of Microelectronics of Chinese Academy of Sciences,Beijing 100029,China
DOI:10.16157/j.issn.0258-7998.2016.08.014
Author:Pei Gen,Shi Zhaoyang,Zou Xuecheng,Liu Zhenglin
Author Affilications:School of Optical and Electronic Information,Huazhong University of Science and Technology,Wuhan 430074,China
DOI:10.16157/j.issn.0258-7998.2016.08.015
Author:Liu Wenjian,Cai Huajie,Zhu Weijie
Author Affilications:Department of Information Engineering, Engineering University of CAPF,Xi′an 710086,China
DOI:10.16157/j.issn.0258-7998.2016.08.016
Author:Huang Hangchang1,Yu Lei2,Tang Xiaosheng2,Jiang Xilun2
Author Affilications:1.Fujian Xinye Investment and Management Group Co.,Ltd,Xiamen 361022,China; 2.School of Information and Communication Engineering,Beijing University of Posts and Telecommunications,Beijing 100876,China
DOI:10.16157/j.issn.0258-7998.2016.08.017
Author:Zhong Kangzheng,Xu Huiyong
Author Affilications:Department of Information Engineering,China University of Geoscience(Beijing),Beijing 100083,China
DOI:10.16157/j.issn.0258-7998.2016.08.018
Author:Liang Ye1,Jian Xianzhong1,Xiao Erliang1,Jiang Guanxiang2,Cai Liumei2,Zheng Zhaoping2
Author Affilications:1.School of Optical-Electrical and Computer Engineering,University of Shanghai for Sience and Technology, Shanghai 200093,China; 2.Shanghai Supore Instruments Co.,Ltd,Shanghai 200444,China
DOI:10.16157/j.issn.0258-7998.2016.08.019
Author:Huang Yu1,Chen Ming1,Yan Yi1,He Zhenhui1,3,Wang Zixin2,3
Author Affilications:1.School of Physics and Engineering,Sun Yat-sen University,Guangzhou 510275,China; 2.School of Electronics And Information Technology,Sun Yat-sen University,Guangzhou 511400,China; 3.Center for Space Technology, Sun Yat-sen University,Zhuhai 519082,China
DOI:10.16157/j.issn.0258-7998.2016.08.020
Author:Xu Gaobin1,Min Rui1,Chen Xing1,Ma Yuanming1,Jin Chuan′en2
Author Affilications:1.Micro Electromechanical System Research Center of Engineering and Technology of Anhui Province, School of Electronic Science & Applied Physics,Hefei University of Technology,Hefei 230009,China; 2.Silicon Ark Technology Co.Ltd,Hefei 230000,China
DOI:10.16157/j.issn.0258-7998.2016.08.021
Author:Wang Long1,Yang Chengzhi1,Wu Hongchao1,Yang Binbin2
Author Affilications:1.Department of Information Confront,Aviation University of Air Force,Changchun 130022,China; 2.School of Electronic and Information, Shenyang Aerospace University,Shenyang 110136,China
DOI:10.16157/j.issn.0258-7998.2016.08.022
Author:Yang Li,Hu Fangqiang
Author Affilications:College of Computer Science and Technology,Nanjing Technology University,Nanjing 211816,China
DOI:10.16157/j.issn.0258-7998.2016.08.023
Author:Sun Zhiquan1,Zhou Weibin2,Zhao Buhui2
Author Affilications:1.Industry Center,Jiangsu University,Zhenjiang 212013,China; 2.School of Electrical and Information Engineering,Jiangsu University,Zhenjiang 212013,China
DOI:10.16157/j.issn.0258-7998.2016.08.024
Author:Ni Peifeng,Hu Xiong
Author Affilications:College of Logistics Engineering,Shanghai Maritime University,Shanghai 201306,China
DOI:10.16157/j.issn.0258-7998.2016.08.025
Author:Zhang Longfei,Han Fangyuan,Liang Qinqin,Liu Chenyao
Author Affilications:Guangxi Scientific Institute of Electric Power,Nanning 530023,China
DOI:10.16157/j.issn.0258-7998.2016.08.026
Author:Cheng Yi,Mao Jingfeng,Wu Guoqing,Wu Aihua,Zhang Xudong,Yang Jiao
Author Affilications:School of Electrical Engineering,Nantong University,Nantong 226019,China
DOI:10.16157/j.issn.0258-7998.2016.08.027
Author:Yao Zhongmin1,He Xu1,Zhai Feifei2
Author Affilications:1.School of Communication and Electronic Engineering, Qiqihar University of China,Qiqihar 161006,China; 2.Shucheng Science and Technology Limited Co. of Tianjin City,Tianjin 300190,China
DOI:10.16157/j.issn.0258-7998.2016.08.028
Author:Wei Yuxin1,Yue Qian2,Chen Changxing1
Author Affilications:1.College of Science,Air Force Engineering University,Xi′an 710051,China; 2.Unit 91033 of PLA,Qingdao 266034,China
DOI:10.16157/j.issn.0258-7998.2016.08.029
Author:Zhou Jie1,2,Zhu Huijuan1,Yuan Mei1
Author Affilications:1.Laboratory of Meteorological Observation and Information Processing, Nanjing University of Information Science and Technology,Nanjing 210044,China; 2.Department of Electronic and Electrical Engineering,Niigata University,Niigata 950-2181,Japan
DOI:10.16157/j.issn.0258-7998.2016.08.030
Author:Jin Shiyan,Yao Yuancheng,Qin Mingwei
Author Affilications:Robot Technology Used for Special Environment Key Laboratory of Sichuan Province,School of Information Engineering, Southwest University of Science and Technology,Mianyang 621010,China
DOI:10.16157/j.issn.0258-7998.2016.08.031
Author:Huang Xin1,Zhao Zhigang2,Wan Rongze1
Author Affilications:1.Network Information Center,Guangxi Agriculture Vocational and Technical College,Nanning 530007,China; 2.College of Computer and Electronics Information,Guangxi University,Nanning 530004,China
DOI:10.16157/j.issn.0258-7998.2016.08.032
Author:Wu Han,Shao Kai,Zhuang Ling,Wang Guangyu
Author Affilications:Chongqing Key Laboratory of Mobile Communications Technology, Chongqing University of Posts and Telecommunications,Chongqing 400065,China
DOI:10.16157/j.issn.0258-7998.2016.08.033
Author:Liu Jianming1,Tang Xia2,Li Long3
Author Affilications:1.College of Computer Science and Engineering,Guilin University of Electronic Technology,Guilin 541004,China; 2.College of Electronic Information and Automation,Guilin University of Electronic Technology,Guilin 541004,China; 3.College of Mechanical and Electrical Engineering,Guilin University of Electronic Technology,Guilin 541004,China
DOI:10.16157/j.issn.0258-7998.2016.08.034
Author:Zhang Yajun1,Luo Xin2
Author Affilications:1.Department of Mechanical and Electrical Engineering,Zhumadian Vocational and Technical College,Zhumadian 463000,China; 2.Department of Electronic Science and Engineering,Huanghuai University,Zhumadian 463000,China
DOI:10.16157/j.issn.0258-7998.2016.08.035
Author:Wu Qiyun,Zhan Yinwei,Shao Yang
Author Affilications:School of Computer,Guangdong University of Technology,Guangzhou 510006,China
DOI:10.16157/j.issn.0258-7998.2016.08.036
Author:Wang Wenqi1,2,Liu Anzhan1,Guo Jifeng1
Author Affilications:1.Zhongyuan University of Technology,Zhengzhou 450007,China; 2.Zhengzhou Key Lab of Network Security Assessment,Zhengzhou 450007,China
DOI:10.16157/j.issn.0258-7998.2016.08.037
Author:Li Yong1,Kong Chunwei2,He Jiai2,Kong Quancun3,Zhao Xiang4
Author Affilications:1.Department of Mechanical Engineering,Beijing Key Laboratory of Precision/Ultra-precision Manufacturing Equipment and Control, Tsinghua University,Beijing 100084,China; 2.School of Computer and Communication,Lanzhou University of Technology,Lanzhou 730050,China; 3.School of Instrumentation Science and Opto-Electronics Engineering,Beijing Information Science and Technology University, Beijing 100192,China; 4.School of Mechanical Engineering,University of Science & Technology Beijing,Beijing 100083,China
DOI:10.16157/j.issn.0258-7998.2016.08.038
Author:Chen Rong1,2,He Songyuan2
Author Affilications:1.School of Electrical Engineering,Yancheng Institute of Technology,Yancheng 224051,China; 2.School of Electrical and Information Engineering,Jiangsu University,Zhenjiang 212013,China
DOI:10.16157/j.issn.0258-7998.2016.08.039
Author:Wei Li1,Wei Jincheng1,Zhu Xiumin1,Long Yong2,Wang Yao2,Cao Taiqiang1
Author Affilications:1.College of Electrical and Electronic Information Engineering,Xihua University,Chengdu 610039,China; 2.School of Electrical and Information Engineering,Southwest University for Nationalities,Chengdu 610041,China
DOI:10.16157/j.issn.0258-7998.2016.08.040
Author:Shi Yongsheng,Tian Weidong,Gao Jingru,Li Li,Gao Danyang
Author Affilications:College of Electrical and Information Engineering, Shaanxi University of Science & Technology,Xi′an 710021,China
DOI:10.16157/j.issn.0258-7998.2016.08.041
Author:Hu Xiaoting1,2,Wang Xin3,Zhang Yishu4,Li Bo3
Author Affilications:1.AVIC Computing Technique Research Institute,Xi′an 710068,China; 2.Aviation Key Laboratory of Science and Technology on Integrated Circuit and Micro-System Design,Xi′an 710068,China; 3.Xi′an Xiangteng Microelectronics Technology CO.,LTD,Xi′an 710068,China; 4.Military Representative Office Stationed in AVIC Computing Technique Research Institute,Xi′an 710019,China
DOI:10.16157/j.issn.0258-7998.2016.08.042
Author:Wu Xiaocheng1,2,Yang Feng1,2,Huai Zhihua1,2,Bai Meijuan3
Author Affilications:1.AVIC Computing Technique Research Institute,Xi′an 710068,China; 2.Aviation Key Laboratory of Science and Technology on Integrated Circuit and Micro-System Design,Xi′an 710068,China; 3.Xi′an Xiangteng Microelectronics Technology CO.,LTD,Xi′an 710068,China
DOI:10.16157/j.issn.0258-7998.2016.08.043
Author:Liu Juan1,2,Wang Hongtao3,Li Juan3,Tian Wenjuan3
Author Affilications:1.AVIC Computing Technique Research Institute,Xi′an 710068,China; 2.Aviation Key Laboratory of Science and Technology on Integrated Circuit and Micro-System Design,Xi′an 710068,China; 3.Xi′an Xiangteng Microelectronics Technology CO.,LTD,Xi′an 710068,China
DOI:10.16157/j.issn.0258-7998.2016.08.044
Author:Niu Shaoping1,2,Shi Jiatao3,Suo Gaohua3,Song Jie3
Author Affilications:1.AVIC Computing Technique Research Institute,Xi′an 710068,China; 2.Aviation Key Laboratory of Science and Technology on Integrated Circuit and Micro-System Design,Xi′an 710068,China; 3.Xi′an Xiangteng Microelectronics Technology CO.,LTD,Xi′an 710068,China
DOI:10.16157/j.issn.0258-7998.2016.08.045
Author:Tian Ze1,2,Suo Gaohua3,Zhang Ronghua1,2,Hong Yuanjia3
Author Affilications:1.AVIC Computing Technique Research Institute,Xi′an 710068,China; 2.Aviation Key Laboratory of Science and Technology on Integrated Circuit and Micro-System Design,Xi′an 710068,China; 3.Xi′an Xiangteng Microelectronics Technology CO.,LTD,Xi′an 710068,China
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