DOI:10.16157/j.issn.0258-7998.2017.01.002
Author:Wen Huidong,Lin Pengrong,Cao Yusheng,Lian Binhao,Wang Yong,Yao Quanbin
Author Affilications:Beijing Microelectronics Technology Institution,Beijing 100076,China
DOI:10.16157/j.issn.0258-7998.2017.01.003
Author:Hou Bin,Xing Ding,Zhang Zhanguo,Zang Jichao,Ma Lei
Author Affilications:The 771 Institute of the Ninth Research Institute of Aerospace Science and Technology Corporation,Xi′an 710000,China
DOI:10.16157/j.issn.0258-7998.2017.01.004
Author:Wang Dejing1,2,Zhao Yuanfu1,2,Yao Quanbin1,2,Cao Yusheng1,2,Lian Binhao1,2,Hu Peifeng1,2
Author Affilications:1.Beijing MXTronics Corporation,Beijing 100076,China;2.Beijing Microelectronics Technology Institute,Beijing 100076,China
DOI:10.16157/j.issn.0258-7998.2017.01.005
Author:Liu Jiaqi1,Zhao Yuanfu1,2,Wang Liang1,Zheng Hongchao1,Shu Lei2,Li Tongde1
Author Affilications:1.Beijing Microelectronics Technology Institute,Beijing 100076,China;2.Harbin Institute of Technology,Harbin 150001,China
DOI:10.16157/j.issn.0258-7998.2017.01.006
Author:Li Zhao,Zhang Zhanguo,Gao Bo,Chang Zhengyang,Huang Shanpu
Author Affilications:The 771 Institute of the Ninth Research Institute of Aerospace Science and Technology Corporation,Xi′an 710000,China
DOI:10.16157/j.issn.0258-7998.2017.01.007
Author:Zhang Yu1,Guo Kun2
Author Affilications:1.Beijing Satellite Manufacturing Plant,Beijing 100080,China; 2.Beijing Space Power Conversion and Control Engineering Research Center,Bejing 100080,China
DOI:10.16157/j.issn.0258-7998.2017.01.008
Author:Lai Xiaomin,Pan Pengjun,Luo Huanlin,Sun Cong,Zhu Xinzong
Author Affilications:Shanghai Aerospace Electronic Technology Institute,Shanghai 201109,China
DOI:10.16157/j.issn.0258-7998.2017.01.009
Author:Peng Fei,Yang Lu,Wu Jie,Li Yi,Peng Xiaoyan
Author Affilications:Shanghai Aerospace Electronic Technology Institute,Shanghai 201109,China
DOI:10.16157/j.issn.0258-7998.2017.01.010
Author:Tian Mi1,Han Tingting1,Wang Zhigong2
Author Affilications:1.Nanjing Electronic Equipment Institute of China Aerospace Science & Industry Corp,Nanjing 210007,China; 2.Institute of RF & OE ICs of Southeast University,Nanjing 210096,China
DOI:10.16157/j.issn.0258-7998.2017.01.012
Author:Li Longfei,Shi Yangchun,Wang Jianfeng,He Zhanzhuang
Author Affilications:Department of Integrated Circuit Design,Xi′an Microelectronics Technology Institute,Xi′an 710065,China
DOI:10.16157/j.issn.0258-7998.2017.01.013
Author:Song Liguo1,Hu Chengxiu2,Qi Hongliang1
Author Affilications:1.Beijing Microelectronics Institute of Technology,Beijing 100076,China; 2.Beijing Aerospace Institute of Systems Engineering,Beijing 100076,China
DOI:10.16157/j.issn.0258-7998.2017.01.014
Author:Li Mengliang,Yue Lipeng,Zhang Jianjun,Zheng Hongchao
Author Affilications:772 Research Institution,China Space Electronic Technology Academy,Beijing 100076,China
DOI:10.16157/j.issn.0258-7998.2017.01.016
Author:Yu Xiankun,Jiang Shuang,Wang Lei,Wang Li,Peng Bin
Author Affilications:The772 Institute of the Ninth Research Institute,China Aerospace Science and Technology Group,Beijing 100076,China
DOI:10.16157/j.issn.0258-7998.2017.01.017
Author:Jiang Anping,Niu Yanbo,Hu Wenrui,Hu Guicai,Wu Xiaojing,Liu Liquan,Liu Lili,He Yu
Author Affilications:Beijing Microelectronics Technology Institute,Beijing 100076,China
DOI:10.16157/j.issn.0258-7998.2017.01.018
Author:Yang Long,Wang Zongmin
Author Affilications:Beijing Microelectronics Tech. Institution,Beijing 100076,China
DOI:10.16157/j.issn.0258-7998.2017.01.019
Author:Yan Pan,Zhang Qirong,Quan Haiyang
Author Affilications:Beijing Microelectronics Technology Research Institute,Beijing 100076,China
DOI:10.16157/j.issn.0258-7998.2017.01.020
Author:Sun Jingyao,He Yu,Li Xuemei
Author Affilications:Beijing MXTronics Corporation,Beijing 100076,China
DOI:10.16157/j.issn.0258-7998.2017.01.011
Author:Wang Fei,Zhang Shasha,Wang Xi
Author Affilications:771 Institute of China Aerospace,Xi′an 710119,China
DOI:10.16157/j.issn.0258-7998.2017.01.015
Author:Li Menglin,Zheng Dongfei
Author Affilications:Xi′an Microelectronics Technology Institute,Xi′an 710054,China
DOI:10.16157/j.issn.0258-7998.2017.01.001
Author:Li Tongde1,Zhao Yuanfu1,2,Wang Liang1,Zheng Hongchao1,Shu Lei2,Liu Jiaqi1,Yu Chunqing1
Author Affilications:1.Beijing Microelectronics Technology Institute,Beijing 100076,China;2.Harbin Institute of Technology,Harbin 150001,China
DOI:10.16157/j.issn.0258-7998.2017.01.021
Author:Wei Yamin1,2,Li Yi1,2,Zhang Shen2,Zhang Ran1,2
Author Affilications:1.School of Information and Electrical Engineering,China University of Mining and Technology,Xuzhou 221008,China; 2.Internet of Things Perception Mine Research Center,China University of Mining and Technology,Xuzhou 221008,China
DOI:10.16157/j.issn.0258-7998.2017.01.022
Author:Chen Shuangye,Xu Wenzheng,Ding Shuangchun,Xian Yaoshan
Author Affilications:College of Electronic Information and Control Engineering,Beijing University of Technology,Beijing 100124,China
DOI:10.16157/j.issn.0258-7998.2017.01.023
Author:Bai Yu1,Yang Binbin1,Yang Chengzhi2,Wang Long2
Author Affilications:1.School of Electronic and Information,Shenyang Aerospace University,Shenyang 110136,China; 2.Department of Electronic Countermeasures,Aviation University of Air Force,Changchun 130022,China
DOI:10.16157/j.issn.0258-7998.2017.01.024
Author:Ji Xiaodi,Luo Liwen
Author Affilications:School of Electronic Information and Electrical Engineering,Shanghai Jiao Tong University,Shanghai 200240,China
DOI:10.16157/j.issn.0258-7998.2017.01.025
Author:Wu Kai,Liu Yan,Tong Baotong,Xing Xiaoman,Dai Yakang
Author Affilications:Suzhou Institute of Biomedical Engineering and Technology,Chinese Academy of Sciences,Suzhou 215163,China
DOI:10.16157/j.issn.0258-7998.2017.01.026
Author:Hu Bijun,Liang Huaguo,Yi Maoxiang,Xu Dawen,Xu Xiumin
Author Affilications:School of Electronic Science & Applied Physics,Hefei University of Technology,Hefei 230009,China
DOI:10.16157/j.issn.0258-7998.2017.01.027
Author:Wang Minglei,Li Juan,Dang Bin,Su Guanqun
Author Affilications:Shandong Institute of Standardization,Jinan 250014,China
DOI:10.16157/j.issn.0258-7998.2017.01.028
Author:Guo Yijing,Yan Yuyue,Gao Fengqiang
Author Affilications:School of Information Science and Technology,Xiamen University Tan Kah Kee College,Zhangzhou 363105,China
DOI:10.16157/j.issn.0258-7998.2017.01.029
Author:Wang Yongtao1,Zhu Jun1,2,Li Dongming1,Hu Yabin1
Author Affilications:1.School of Automation,China University of Geosciences,Wuhan 430074,China; 2.School of Telecommunications,Hubei Radio & TV University,Wuhan 430074,China
DOI:10.16157/j.issn.0258-7998.2017.01.030
Author:Tang Weiping1,Liu Guiying2
Author Affilications:1.Department of Automotive and Transportation,Guangxi Electric Power Institute of Vocational Training,Nanning 530007,China; 2.Institute of Vocational Education,Guangxi Terchers Education University,Nanning 530001,China
DOI:10.16157/j.issn.0258-7998.2017.01.031
Author:Li Jiani,Wang Yunfeng
Author Affilications:Beijing Key Laboratory of Radio Frequency IC Technology for Next Generation Communications,Institute of Microelectronics of the Chinese Academy of Sciences,University of Chinese Academy of Sciences,Beijing 100029,China
DOI:10.16157/j.issn.0258-7998.2017.01.032
Author:Ren Zhi,You Lei,Chen Cong,Lv Yuhui
Author Affilications:Chongqing Key Lab of Mobile Communications,Chongqing University of Posts and Telecommunications,Chongqing 400065,China
DOI:10.16157/j.issn.0258-7998.2017.01.033
Author:Cao Chengtao1,2,Xu Lunhui2
Author Affilications:1.Intelligent Traffic Engineering Technology Center,Guangdong Communication Polytechnic,Guangzhou 510650,China; 2.South China University of Technology,Guangzhou 510640,China
DOI:10.16157/j.issn.0258-7998.2017.01.034
Author:Zhuo Guofeng1,Du Shengdong2,Lin Shengbin3
Author Affilications:1.School of Software,Chengdu Polytechnic,Chengdu 610041,China; 2.School of Information Science and Technology,Southwest Jiaotong University,Chengdu 610031,China; 3.Chongqing Communication Institute,Chongqing 400000,China
DOI:10.16157/j.issn.0258-7998.2017.01.035
Author:Wen Wu1,2,Qiao Longhui1,He Peng1
Author Affilications:1.Chongqing University of Posts and Telecommunications,Chongqing 400065,China; 2.Chongqing Information Technology Designing Co.,Ltd.,Chongqing 400065,China
DOI:10.16157/j.issn.0258-7998.2017.01.036
Author:Huang Hesong,Liu Rongliang,Guo Henglan,Wei Guozhao
Author Affilications:College of Electrical and Automation Engineering,Shandong University of Science and Technology,Qingdao 266590,China
DOI:10.16157/j.issn.0258-7998.2017.01.037
Author:Song Changming,Hui Qinglei,Cheng Dongxu
Author Affilications:College of Science,Zhongyuan University of Technology,Zhengzhou 450007,China
DOI:10.16157/j.issn.0258-7998.2017.01.038
Author:Pan Zhenfu,Xu Jing,Liu Cheng,Zhu Yongli
Author Affilications:Department of Computer Science,North China Electric Power University,Baoding 071003,China
DOI:10.16157/j.issn.0258-7998.2017.01.039
Author:Zhang Xin,Jia Erju,Fan Xingming
Author Affilications:Department of Electrical Engineering & Automation,Guilin University of Electronic and Technology,Guilin 541004,China
DOI:10.16157/j.issn.0258-7998.2017.01.040
Author:Guo Xiaoying1,Wang Jialei2,Li Fansen2,Chen Xiandong2,Cao Taiqiang2
Author Affilications:1.School of Information and Electric Engineering,Panzhihua University,Panzhihua 617000,China; 2.School of Electrical Engineering and Electronic Information,Xihua University,Chengdu 610039,China
DOI:10.16157/j.issn.0258-7998.2017.01.041
Author:Shen Juan1,Zhou Shi2
Author Affilications:1.State Grid.Shanghai Electric Power Company.Electric Power Research Institute,Shanghai 200051,China; 2.Shanghai Electric Group Co.,Ltd.Central Academe,Shanghai 200070,China
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