DOI:10.16157/j.issn.0258-7998.183313
Author:An Henan,Zhang Changlin,Tu Zhiwei,Zhao Guangjun,Liu Jia,Li Wei
Author Affilications:School of Electronic Science and Technology,Shenzhen University,Shenzhen 518061,China
DOI:10.16157/j.issn.0258-7998.183235
Author:Shi Yuanbo1,Zhang Xinming1,Huang Yueyang2
Author Affilications:1.School of Computer and Communication Engineering,Liaoning Shihua University,Fushun 113001,China; 2.School of Information and Control Engineering,Liaoning Shihua University,Fushun 113001,China
DOI:10.16157/j.issn.0258-7998.182304
Author:Yang Wei,Zhang Caijun,Ma Yongbo
Author Affilications:IT Department,State Grid Customer Service Center,Tianjin 300000,China
DOI:10.16157/j.issn.0258-7998.181755
Author:Yao Yuchen,Peng Hu
Author Affilications:School of Instrument Science and Opto-electronics Engineering,Hefei University of Technology,Hefei 230009,China
DOI:10.16157/j.issn.0258-7998.181774
Author:Xin Haiwei,Liu Zhangli
Author Affilications:Shanghai Huahong Grace Semiconductor Manufacturing Corporation,Shanghai 201203,China
DOI:10.16157/j.issn.0258-7998.181928
Author:Su Wei1,2,Feng Xi1,2,Zhou Zhimei1,2,Hu Yi1,2,Tang Xiaoke1,2
Author Affilications:1.State Grid Key Laboratory of Power Industrial Chip Design and Analysis Technology, Beijing Smart-Chip Microelectronics Technology Co.,Ltd.,Beijing 100192,China; 2.Beijing Engineering Research Center of High-reliability IC with Power Industrial Grade, Beijing Smart-Chip Microelectronics Technology Co.,Ltd.,Beijing 100192,China
DOI:10.16157/j.issn.0258-7998.181708
Author:Ma Chengcheng1,2,Tian Ze1,2,Li Xiaoyu1,2,Sun Linna3
Author Affilications:1.China Aeronautical Computing Research Institute,Xi′an 710068,China; 2.Aviation Key Laboratory of Science and Technology on Integrated Circuit and Micro-System Design,Xi′an 710068,China; 3.Xiangteng Microelectronics Technology Co.,LTD.,Xi′an 710068,China
DOI:10.16157/j.issn.0258-7998.181851
Author:He Yang,Ma Yongwang,Hou Jiali,Wang Xiaoman,Hu Yi,Feng Xi,Tang Xiaoke
Author Affilications:1.State Grid Key Laboratory of Power Industrial Chip Design and Analysis Technology, Beijing SmartChip Microelectronics Technology Co.,Ltd.,Beijing 100192,China; 2.Beijing Engineering Research Center of High-reliability IC with Power Industrial Grade, Beijing Smart-Chip Microelectronics Technology Co.,Ltd.,Beijing 100192,China
DOI:10.16157/j.issn.0258-7998.181756
Author:Li Mintao
Author Affilications:Department of Electrical and Electric Engineering,Wenzhou Vocational & Technical College,Wenzhou 325000,China
DOI:10.16157/j.issn.0258-7998.181714
Author:Qiao Xuguang1,Jiang Zhaoneng1,2,Zhao Xiaoyan1,Shui Mingyue1,Lu Xiaochi1,Zhang Bangbang1
Author Affilications:1.Department of Information Engineering,Hefei University of Technology,Xuancheng 242000,China; 2.State Key Laboratory of Millimeter Waves,Nanjing 210096,China
DOI:10.16157/j.issn.0258-7998.182529
Author:Xu Yunfei1,Zhang Haining1,Zhong Cheng2,Li Yingchao1,Liu Hongyang1
Author Affilications:1.State Grid Economic Research Institute of East Inner Mongolia Electric Power Company Limited,Hohhot 010020,China; 2.College of Electrical Engineering,Northeast Electric Power University,Jilin 132012,China
DOI:10.16157/j.issn.0258-7998.182703
Author:Gu Zeling,Yang Mingyuan,Ding Honghui,Heng Yan
Author Affilications:The Institute of Shanghai Radio Equipment,Shanghai 200090,China
DOI:10.16157/j.issn.0258-7998.182818
Author:Kang Guodong1,Xue Chao2,Li Linlin1,Cui Yufu1
Author Affilications:1.DFH Satellite Co.,Ltd.,Beijing 100094,China;2.Aerospace Star Co.,Ltd.,Beijing 100086,China
DOI:10.16157/j.issn.0258-7998.182905
Author:Wang Qian1,2,Xu Yajie1,Zeng Guoqiang2,Sun Mingshan1
Author Affilications:1.Medical Imaging Department,Suzhou Institute of Biomedical Engineering and Technology, Chinese Academy of Sciences,Suzhou 215163,China; 2.College of Nuclear Technology and Automation Engineering,Chengdu University of Technology,Chengdu 610051,China
DOI:10.16157/j.issn.0258-7998.182073
Author:Qiu Zhongwei,Ren Zhi,Ge Lijia
Author Affilications:School of Communication and Information Engineering,Chongqing University of Posts and Telecommunications, Chongqing 400065,China
DOI:10.16157/j.issn.0258-7998.182196
Author:Qi Chang,Yang Longxiang
Author Affilications:College of Communication and Information Engineering,Nanjing University of Posts and Telecommunications,Nanjing 210003,China
DOI:10.16157/j.issn.0258-7998.182688
Author:Li Feng,Li Xiaodan
Author Affilications:Key Laboratory of Instrumentation Science & Dynamic Measurement,Ministry of Education, North University of China,Taiyuan 030051,China
DOI:10.16157/j.issn.0258-7998.182469
Author:Yang Sheng
Author Affilications:School of Information and Communication,Guilin University of Electronic Technology,Guilin 541004,China
DOI:10.16157/j.issn.0258-7998.183076
Author:Tian Zilin,Chen Jiaxin
Author Affilications:College of Information Engineering,Henan University of Science and Technology,Luoyang 471023,China
DOI:10.16157/j.issn.0258-7998.182079
Author:Xiao Tao
Author Affilications:Electric Power Research Institute of State Grid Zhejiang Electric Power Co.,Ltd.,Hangzhou 310014,China
DOI:10.16157/j.issn.0258-7998.183096
Author:Jiang Huaqiang1,2,Cai Yong1,2,Zhang Jiansheng1,Li Zisheng1,2
Author Affilications:1.School of Manufacturing Science and Engineering,Southwest University of Science and Technology,Mianyang 621010,China; 2.Key Laboratory of Testing Technology for Manufacturing Process,Mianyang 621010,China
DOI:10.16157/j.issn.0258-7998.182981
Author:Zhang Xiaoming1,Cao Guoqing1,2,Chen Zengqiang1,He Jiakang1,2
Author Affilications:1.School of Information Engineering,Beijing Institute of Petrochemical Technology,Beijing 102617,China; 2.School of Information Science and Technology,Beijing University of Chemical Technology,Beijing 100029,China
DOI:10.16157/j.issn.0258-7998.182461
Author:Hou Kaiqiang,Shi Junnan,Xu Yanzhang,Qiu Xiaoyan
Author Affilications:Shanghai Radio Equipment Research Institute,Shanghai 200090,China
DOI:10.16157/j.issn.0258-7998.182476
Author:Chen Xudong1,Zhou Yuqi2,Li Mengjie1,Chen Zhangjin1,3
Author Affilications:1.Microelectronic Research and Development Center,Shanghai University,Shanghai 200444,China; 2.Research Center of Nano-Science and Nano-Technology,Shanghai 200444,China; 3.Computer Center,Shanghai University,Shanghai 200444,China
DOI:10.16157/j.issn.0258-7998.182260
Author:Sun Cao1,Liu Shixing1,Song Yajie1,Huang Fei1,Lu Wei1,Zhang Shensheng2,Wang Jinbo2,Chen Qiang2
Author Affilications:1.School of Electronic Science & Applied Physics,Hefei University of Technology,Hefei 230009,China; 2.Anhui Special Equipment Inspection Institute,Hefei 230051,China
DOI:10.16157/j.issn.0258-7998.181630
Author:Yu Zhong′an,Ge Tingyu,Liang Jianwei
Author Affilications:School of Electrical Engineering and Automation,Jiangxi University of Science and Technology,Ganzhou 341000,China
DOI:10.16157/j.issn.0258-7998.182029
Author:Zhu Zhenyuan,Cao Yilong,Jiang Youhua,Huang Guanhua
Author Affilications:School of Electronics and Information Engineering,Shanghai University of Electric Power,Shanghai 200090,China
DOI:10.16157/j.issn.0258-7998.181689
Author:Pan Jian,Liu Tianjun,Li Jiacheng
Author Affilications:Hubei Collaborative Innovation Center for High-efficiency Utilization of Solar Energy, Hubei University of Technology,Wuhan 430068,China
DOI:10.16157/j.issn.0258-7998.180627
Author:Gao Jun1,2,Huang Daoping2,Lu Jiafeng2
Author Affilications:1.School of Automation Science and Engineering,South China University of Technology,Guangzhou 510640,China; 2.Scientific Verification & Testing Engineering Technology Co.,Ltd.(GuangDong),Guangzhou 510000,China
DOI:10.16157/j.issn.0258-7998.181430
Author:Gan Deshu1,Pei Xingyu1,Ke Qingpai2,Wu Haixiong1,Lin Guihui1,Cheng Xu1
Author Affilications:1.Guangdong Power Grid Company,Zhuhai Power Supply Bureau,Zhuhai 519000,China; 2.HuaTian Power CO. LTD.,Suzhou 215000,China
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