DOI:10.16157/j.issn.0258-7998.183313
Author:An Henan,Zhang Changlin,Tu Zhiwei,Zhao Guangjun,Liu Jia,Li Wei
Author Affilications:School of Electronic Science and Technology,Shenzhen University,Shenzhen 518061,China
DOI:10.16157/j.issn.0258-7998.183235
Author:Shi Yuanbo1,Zhang Xinming1,Huang Yueyang2
Author Affilications:1.School of Computer and Communication Engineering,Liaoning Shihua University,Fushun 113001,China; 2.School of Information and Control Engineering,Liaoning Shihua University,Fushun 113001,China
DOI:10.16157/j.issn.0258-7998.182304
Author:Yang Wei,Zhang Caijun,Ma Yongbo
Author Affilications:IT Department,State Grid Customer Service Center,Tianjin 300000,China
DOI:10.16157/j.issn.0258-7998.181755
Author:Yao Yuchen,Peng Hu
Author Affilications:School of Instrument Science and Opto-electronics Engineering,Hefei University of Technology,Hefei 230009,China
DOI:10.16157/j.issn.0258-7998.181774
Author:Xin Haiwei,Liu Zhangli
Author Affilications:Shanghai Huahong Grace Semiconductor Manufacturing Corporation,Shanghai 201203,China
DOI:10.16157/j.issn.0258-7998.181928
Author:Su Wei1,2,Feng Xi1,2,Zhou Zhimei1,2,Hu Yi1,2,Tang Xiaoke1,2
Author Affilications:1.State Grid Key Laboratory of Power Industrial Chip Design and Analysis Technology, Beijing Smart-Chip Microelectronics Technology Co.,Ltd.,Beijing 100192,China; 2.Beijing Engineering Research Center of High-reliability IC with Power Industrial Grade, Beijing Smart-Chip Microelectronics Technology Co.,Ltd.,Beijing 100192,China
DOI:10.16157/j.issn.0258-7998.181708
Author:Ma Chengcheng1,2,Tian Ze1,2,Li Xiaoyu1,2,Sun Linna3
Author Affilications:1.China Aeronautical Computing Research Institute,Xi′an 710068,China; 2.Aviation Key Laboratory of Science and Technology on Integrated Circuit and Micro-System Design,Xi′an 710068,China; 3.Xiangteng Microelectronics Technology Co.,LTD.,Xi′an 710068,China
DOI:10.16157/j.issn.0258-7998.181851
Author:He Yang,Ma Yongwang,Hou Jiali,Wang Xiaoman,Hu Yi,Feng Xi,Tang Xiaoke
Author Affilications:1.State Grid Key Laboratory of Power Industrial Chip Design and Analysis Technology, Beijing SmartChip Microelectronics Technology Co.,Ltd.,Beijing 100192,China; 2.Beijing Engineering Research Center of High-reliability IC with Power Industrial Grade, Beijing Smart-Chip Microelectronics Technology Co.,Ltd.,Beijing 100192,China
DOI:10.16157/j.issn.0258-7998.181756
Author:Li Mintao
Author Affilications:Department of Electrical and Electric Engineering,Wenzhou Vocational & Technical College,Wenzhou 325000,China
DOI:10.16157/j.issn.0258-7998.181714
Author:Qiao Xuguang1,Jiang Zhaoneng1,2,Zhao Xiaoyan1,Shui Mingyue1,Lu Xiaochi1,Zhang Bangbang1
Author Affilications:1.Department of Information Engineering,Hefei University of Technology,Xuancheng 242000,China; 2.State Key Laboratory of Millimeter Waves,Nanjing 210096,China
DOI:10.16157/j.issn.0258-7998.182529
Author:Xu Yunfei1,Zhang Haining1,Zhong Cheng2,Li Yingchao1,Liu Hongyang1
Author Affilications:1.State Grid Economic Research Institute of East Inner Mongolia Electric Power Company Limited,Hohhot 010020,China; 2.College of Electrical Engineering,Northeast Electric Power University,Jilin 132012,China
DOI:10.16157/j.issn.0258-7998.182703
Author:Gu Zeling,Yang Mingyuan,Ding Honghui,Heng Yan
Author Affilications:The Institute of Shanghai Radio Equipment,Shanghai 200090,China
DOI:10.16157/j.issn.0258-7998.182818
Author:Kang Guodong1,Xue Chao2,Li Linlin1,Cui Yufu1
Author Affilications:1.DFH Satellite Co.,Ltd.,Beijing 100094,China;2.Aerospace Star Co.,Ltd.,Beijing 100086,China
DOI:10.16157/j.issn.0258-7998.182905
Author:Wang Qian1,2,Xu Yajie1,Zeng Guoqiang2,Sun Mingshan1
Author Affilications:1.Medical Imaging Department,Suzhou Institute of Biomedical Engineering and Technology, Chinese Academy of Sciences,Suzhou 215163,China; 2.College of Nuclear Technology and Automation Engineering,Chengdu University of Technology,Chengdu 610051,China
DOI:10.16157/j.issn.0258-7998.182073
Author:Qiu Zhongwei,Ren Zhi,Ge Lijia
Author Affilications:School of Communication and Information Engineering,Chongqing University of Posts and Telecommunications, Chongqing 400065,China
DOI:10.16157/j.issn.0258-7998.182196
Author:Qi Chang,Yang Longxiang
Author Affilications:College of Communication and Information Engineering,Nanjing University of Posts and Telecommunications,Nanjing 210003,China
DOI:10.16157/j.issn.0258-7998.182688
Author:Li Feng,Li Xiaodan
Author Affilications:Key Laboratory of Instrumentation Science & Dynamic Measurement,Ministry of Education, North University of China,Taiyuan 030051,China
DOI:10.16157/j.issn.0258-7998.182469
Author:Yang Sheng
Author Affilications:School of Information and Communication,Guilin University of Electronic Technology,Guilin 541004,China
DOI:10.16157/j.issn.0258-7998.183076
Author:Tian Zilin,Chen Jiaxin
Author Affilications:College of Information Engineering,Henan University of Science and Technology,Luoyang 471023,China
DOI:10.16157/j.issn.0258-7998.182079
Author:Xiao Tao
Author Affilications:Electric Power Research Institute of State Grid Zhejiang Electric Power Co.,Ltd.,Hangzhou 310014,China
DOI:10.16157/j.issn.0258-7998.183096
Author:Jiang Huaqiang1,2,Cai Yong1,2,Zhang Jiansheng1,Li Zisheng1,2
Author Affilications:1.School of Manufacturing Science and Engineering,Southwest University of Science and Technology,Mianyang 621010,China; 2.Key Laboratory of Testing Technology for Manufacturing Process,Mianyang 621010,China
DOI:10.16157/j.issn.0258-7998.182981
Author:Zhang Xiaoming1,Cao Guoqing1,2,Chen Zengqiang1,He Jiakang1,2
Author Affilications:1.School of Information Engineering,Beijing Institute of Petrochemical Technology,Beijing 102617,China; 2.School of Information Science and Technology,Beijing University of Chemical Technology,Beijing 100029,China
DOI:10.16157/j.issn.0258-7998.182461
Author:Hou Kaiqiang,Shi Junnan,Xu Yanzhang,Qiu Xiaoyan
Author Affilications:Shanghai Radio Equipment Research Institute,Shanghai 200090,China
DOI:10.16157/j.issn.0258-7998.182476
Author:Chen Xudong1,Zhou Yuqi2,Li Mengjie1,Chen Zhangjin1,3
Author Affilications:1.Microelectronic Research and Development Center,Shanghai University,Shanghai 200444,China; 2.Research Center of Nano-Science and Nano-Technology,Shanghai 200444,China; 3.Computer Center,Shanghai University,Shanghai 200444,China
DOI:10.16157/j.issn.0258-7998.182260
Author:Sun Cao1,Liu Shixing1,Song Yajie1,Huang Fei1,Lu Wei1,Zhang Shensheng2,Wang Jinbo2,Chen Qiang2
Author Affilications:1.School of Electronic Science & Applied Physics,Hefei University of Technology,Hefei 230009,China; 2.Anhui Special Equipment Inspection Institute,Hefei 230051,China
DOI:10.16157/j.issn.0258-7998.181630
Author:Yu Zhong′an,Ge Tingyu,Liang Jianwei
Author Affilications:School of Electrical Engineering and Automation,Jiangxi University of Science and Technology,Ganzhou 341000,China
DOI:10.16157/j.issn.0258-7998.182029
Author:Zhu Zhenyuan,Cao Yilong,Jiang Youhua,Huang Guanhua
Author Affilications:School of Electronics and Information Engineering,Shanghai University of Electric Power,Shanghai 200090,China
DOI:10.16157/j.issn.0258-7998.181689
Author:Pan Jian,Liu Tianjun,Li Jiacheng
Author Affilications:Hubei Collaborative Innovation Center for High-efficiency Utilization of Solar Energy, Hubei University of Technology,Wuhan 430068,China
DOI:10.16157/j.issn.0258-7998.180627
Author:Gao Jun1,2,Huang Daoping2,Lu Jiafeng2
Author Affilications:1.School of Automation Science and Engineering,South China University of Technology,Guangzhou 510640,China; 2.Scientific Verification & Testing Engineering Technology Co.,Ltd.(GuangDong),Guangzhou 510000,China
DOI:10.16157/j.issn.0258-7998.181430
Author:Gan Deshu1,Pei Xingyu1,Ke Qingpai2,Wu Haixiong1,Lin Guihui1,Cheng Xu1
Author Affilications:1.Guangdong Power Grid Company,Zhuhai Power Supply Bureau,Zhuhai 519000,China; 2.HuaTian Power CO. LTD.,Suzhou 215000,China
Information Flow and Energy Flow in Industrial Digital Transformation
Special Antenna and Radio Frequency Front End
Radar Target Tracking Technology
Key Technologies of 5G-A and 6G
Key Technologies of 5G and Its Evolution
Key Technologies of 5G and Its Evolution
Processing and Application of Marine Target Characteristic Data
Antenna Technology and Its Applications
5G Vertical Industry Application
Microelectronics in Medical and Healthcare
Application of Edge Computing in IIoT
Deep Learning and Image Recognization
6G Microwave Millimeter-wave Technology
Radar Processing Technology and Evaluation
Space-Ground Integrated Technology
5G Vertical Industry Application
FPGA and Artificial Intelligence
Innovation and Application of PKS System
5G Network Construction and Optimization
Network and Business Requirements for 6G
5G and Intelligent Transportation
5G R16 Core Network Evolution Technology
Satellite Nevigation Technology
5G Wireless Network Evolution Technology
5G Network Planning Technology
5G Co-construction and Sharing Technology
5G and Emergency Communication
5G Slicing Technology and Its Applications
5G Terminal Key Realization Technology
5G and Artificial Intelligence
Terahertz Technology and Its Application
Signal and Information Processing
Internet of Things and the Industrial Big Data
Electronic Techniques of UAV System
Aerospace Electronic Technology
Robot and Industrial Automation
ADAS Technique and Its Implementation
2016 IEEE International Conference on Integrated Circuits and Microsystems
Measurement and Control Technology of Bus Network
Key Techniques of 5G and Algorthm Implement