DOI:10.16157/j.issn.0258-7998.190909
Author:Zhang Zhirong,Xu Xiaohang,Zhu Xuetian,Xia Xu
Author Affilications:China Telecom Corporation Limited Intelligent Network and Terminal Research Institute,Beijing 102209,China
DOI:10.16157/j.issn.0258-7998.190922
Author:Wang Haining,Jia Peng,Cao Yushi,Yang Fucong,Pei Tiantian,Zeng Yu
Author Affilications:Network AI Research Center,Research Institute of Emerging Information Technology, Institute of Strategic and Innovative Research of China Telecom Co.,Ltd.,Beijing 102209,China
DOI:10.16157/j.issn.0258-7998.190980
Author:Zou Guangling,Zhang Shouxia,Zhu Yongjun,Xie Weihao
Author Affilications:ZTE Corporation,Shanghai 201203,China
DOI:10.16157/j.issn.0258-7998.190923
Author:Wei Pengtao,Zeng Yu,Wang Haining,Li Xiao,Yao Peijun,Li Mengchi,Xu Yimou
Author Affilications:Network AI Research Center,Research Institute of Emerging Information Technology, Institute of Strategic and Innovative Research of China Telecom Co.,Ltd.,Beijing 102209,China
DOI:10.16157/j.issn.0258-7998.190988
Author:Wang Xuliang1,Liu Zengyi1,Hu Yajie2,Li Tongyao2
Author Affilications:1.China Telecommunication Research Institute,Beijing 102209,China; 2.Institute of Information Photonics and Optical Communications,School of Information and Communication Engineering, Beijing University of Posts and Telecommunications,Beijing 100035,China
DOI:10.16157/j.issn.0258-7998.190743
Author:Chen Yuxiang1,2,Hao Yao1,2,Zhao Yue1,2,Liao Sijie1,3,Yang Jiaxing1,3,Yi Zhongqiang1,2
Author Affilications:1.Science and Technology on Communication Security Laboratory,Chengdu 610041,China; 2.No.30 Institute,China Electronics Technology Group Corporation,Chengdu 610041,China; 3.CETC Cyberspace Security Research Institute Co.,Ltd.,Chengdu 610041,China
DOI:10.16157/j.issn.0258-7998.190248
Author:Yin Xiaoyu,Alimjan Aysa,Kurban Ubul
Author Affilications:School of Information Science & Engineering,Xinjiang University,Urumqi 830046,China
DOI:10.16157/j.issn.0258-7998.190359
Author:Li Yuanbo,Yang Yuan,Zhang Xiaotao
Author Affilications:Department of Electronics Engineering,Xi′an University of Technology,Xi′an 710048,China
DOI:10.16157/j.issn.0258-7998.190356
Author:Zhang Tianfei,Long Haiyan,Ding Jiao,Zhang Lei
Author Affilications:Anhui Institute of Information Technology,Wuhu 241000,China
DOI:10.16157/j.issn.0258-7998.190522
Author:Tuo Zhao,Chen Tao,Li Wei,Nan Longmei
Author Affilications:Cryptography College,Information Engineering University,Zhengzhou 450001,China
DOI:10.16157/j.issn.0258-7998.190484
Author:Ding Ke,Zhang Jun,Jiang Weijun
Author Affilications:Cellixsoft Corporation,Beijing 100095,China
DOI:10.16157/j.issn.0258-7998.182990
Author:Xu Liguo1,2,Li Dejian1,2,Yu Baodong1,2,Yang lixin1,2,Wang Xiaoman1,2
Author Affilications:1.State Grid Key Laboratory of Power Industrial Chip Design and Analysis Technology, Beijing Smart-Chip Microelectronics Technology Co.,Ltd.,Beijing 100192,China; 2.Beijing Engineering Research Center of High-reliability IC with Power Industrial Grade, Beijing Smart-Chip Microelectronics Technology Co.,Ltd.,Beijing 100192,China
DOI:10.16157/j.issn.0258-7998.190275
Author:Chen Lin,Tang Jun,Qu Tongzhou,Yin Anqi
Author Affilications:Information Engineering University,Zhengzhou 450000,China
DOI:10.16157/j.issn.0258-7998.190413
Author:Duan Qingming,Wang Fan,Xu Linlin,Quan Wenjun
Author Affilications:College of Instrumentation & Electrical Engineering,Jilin University,Changchun 130012,China
DOI:10.16157/j.issn.0258-7998.190014
Author:Sun Cheng1,Huang Yu2,Zhu Jianping1,Zhang Baojian1,Zhang Zhiyuan1,Wang Yajing2
Author Affilications:1.Shanghai Sunest Electricity Technology Co.,Ltd.,Nanjing 210000,China; 2.Shandong University of Technology,Zibo 255000,China
DOI:10.16157/j.issn.0258-7998.190654
Author:Liu Song,Li Yue,Liu Peng
Author Affilications:School of Electrical and Electronic Engineering,North China Electric Power University,Beijing 102206,China
DOI:10.16157/j.issn.0258-7998.190618
Author:Zhang Haifeng1,2,Liu Jun1,2,Chong Ting1,2,Yuan Yidong1,2
Author Affilications:1.State Grid Key Laboratory of Power Industrial Chip Design and Analysis Technology, Beijing Smart-Chip Microelectronics Technology Co.,Ltd.,Beijing 100192,China; 2.Beijing Engineering Research Center of High-reliability IC with Power Industrial Grade, Beijing Smart-Chip Microelectronics Technology Co.,Ltd.,Beijing 100192,China
DOI:10.16157/j.issn.0258-7998.190531
Author:Pan Shesu1,2,Zhang Jijun2,Zhang Zhaofeng2
Author Affilications:1.College of Materials Science and Engineering,Shanghai University,Shanghai 201900,China; 2.Shanghai Advanced Research Institute,Chinese Academy Sciences,Shanghai 200120,China
DOI:10.16157/j.issn.0258-7998.190452
Author:An Ting
Author Affilications:School of Automation and Electrical Engineering,Linyi University,Linyi 276000,China
DOI:10.16157/j.issn.0258-7998.190537
Author:Liu Peng1,Zheng Yong2,Yang Hongjun3
Author Affilications:1.Shandong MGdaas Systems Co.,Ltd.,Jinan 250100,China; 2.Shandong Agricultural Information Center,Jinan 250100,China;3.Jinan Agricultural Information Center,Jinan 250002,China
DOI:10.16157/j.issn.0258-7998.190357
Author:Luo Xiaoyi1,Zhang Lijun2,He Xiaobin1,Zhang Qin1,Shi Yingying1,Xu Yanming1
Author Affilications:1.Shanghai Aerospace Equipment Manufactory Co.,Ltd.,Shanghai 200245,China; 2.School of Automation China University of Geosciences(Wuhan),Wuhan 430070,China
DOI:10.16157/j.issn.0258-7998.190572
Author:Zheng Baiheng1,Zhu Huihui2,Liu Shengli1,Zhao Heng1
Author Affilications:1.Southwest China Institute of Electronic Technology,Chengdu 610036,China; 2.Xifei Design Institute of Aviation Industry,Xi′an 710089,China
DOI:10.16157/j.issn.0258-7998.190661
Author:Yang Lin1,Dai Jianfeng1,Zhao Hucheng2,Gao Zhan2,Lu Yang1,Sun Xueming2
Author Affilications:1.Department of Biomedical Engineering,The First Affiliated Hospital of Soochow University,Suzhou 215006,China; 2.Changzhou Kebo Electronic Technology Co.,LTD.,Changzhou 213005,China
DOI:10.16157/j.issn.0258-7998.190753
Author:Zhang Jing,Bu Gang
Author Affilications:School of Electronic Information Engineering,Nanjing University of Aeronautics and Astronautics,Nanjing 211106,China
DOI:10.16157/j.issn.0258-7998.190659
Author:Ma Zhangyin,Li Wusen,Chen Wenjian
Author Affilications:School of Electronic and Optical Engineering,Nanjing University of Science and Technology,Nanjing 210094,China
DOI:10.16157/j.issn.0258-7998.190712
Author:Wei Na1,Zhao Ergang1,Li Yadong1,Yu Mei1,Li Chunming2,Zhang Jianjun1
Author Affilications:1.College of Electronic Information and Optical Engineering,Nankai University,Tianjin 300350,China; 2.IE-Cheng Technology(Tianjin) Co.,Ltd.,Tianjin 300380,China
DOI:10.16157/j.issn.0258-7998.190517
Author:Liu Jingmeng,Li Siqi
Author Affilications:School of Automatic Science and Electrical Engineering,Beihang University,Beijing 100191,China
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