DOI:10.16157/j.issn.0258-7998.209001
Author:Zhu Xuetian1,Wang Qiuhong1,Zhang Shaowei1,Hou Jijiang2
Author Affilications:1.China Telecom Corporation Research Institute,Beijing 102209,China;2.China Telecom Corporation,Beijing 100033,China
DOI:10.16157/j.issn.0258-7998.209002
Author:Yuan Xueqi1,Yun Xiang2,Li Na2
Author Affilications:1.China Telecom Research Institute,Beijing 102209,China;2.Baicells Technologies Co.,Ltd.,Beijing 100044,China
DOI:10.16157/j.issn.0258-7998.209003
Author:Hou Jia,Mang Ge,Zhu Xuetian
Author Affilications:Beijing Research Institute of China Telecom Co.,Ltd.,Beijing 102209,China
DOI:10.16157/j.issn.0258-7998.209004
Author:Wang Qiuhong,Zhu Xuetian
Author Affilications:China Telecom Corporation Research Institute,Beijing 102209,China
DOI:10.16157/j.issn.0258-7998.191267
Author:Zhou Xiaokang1,Ma Kui1,2,Liang Bei1,2
Author Affilications:1.College of Big Data and Information Engineering,Guizhou University,Guiyang 550025,China; 2.Semiconductor Power Device Reliability Engineering Research Center of Ministry of Education,Guiyang 550025,China
DOI:10.16157/j.issn.0258-7998.191000
Author:Lin Zhiwen,Lin Zhixian,Guo Tailiang,Lin Shanling
Author Affilications:School of Physics and Information Engineering,Fuzhou University,Fuzhou 350116,China
DOI:10.16157/j.issn.0258-7998.190950
Author:Zhao Shuhuan
Author Affilications:College of Electronic and Information Engineering,Hebei University,Baoding 071002,China
DOI:10.16157/j.issn.0258-7998.182747
Author:Fu Ling1,2,He Yang1,2,Tan Lang1,2
Author Affilications:1.State Grid Key Laboratory of Power Industrial Chip Design and Analysis Technology, Beijing Smart-chip Microelectronics Technology Co.,Ltd.,Beijing 100192,China; 2.Beijing Engineering Research Center of High-reliability IC with Power Industrial Grade, Beijing Smart-chip Microelectronics Technology Co.,Ltd.,Beijing 100192,China
DOI:10.16157/j.issn.0258-7998.191229
Author:Wu Xueling,Jiang Hong
Author Affilications:School of Information Engineering, Southwest University of Science and Technology,Mianyang 621000,China
DOI:10.16157/j.issn.0258-7998.190658
Author:Li Xiaqin
Author Affilications:Southwest China Institute of Electronic Technology,Chengdu 610036,China
DOI:10.16157/j.issn.0258-7998.191243
Author:Huang Faliang,You Bin
Author Affilications:Electronic Information College,Hangzhou Dianzi University,Hangzhou 310018,China
DOI:10.16157/j.issn.0258-7998.190816
Author:Tian Haowen,Guo Shixu,Zhu Mengqi,Zhao Peng
Author Affilications:School of Metrological Technology and Engineering,China Jiliang University,Hangzhou 310018,China
DOI:10.16157/j.issn.0258-7998.190864
Author:Yu Qiuting,Xiong Junqiao
Author Affilications:School of Electrical and Information Engineering,Wuhan Institute of Technology,Wuhan 430205,China
DOI:10.16157/j.issn.0258-7998.191034
Author:He Zehao1,Hong Tao1,Chen Jiayan1,Jiang Tianqi2
Author Affilications:1.College of Quality & Safety Engineering,China Jiliang University,Hangzhou 310018,China; 2.Hangzhou Zhihui Information Technology Co.,Ltd.,Hangzhou 310018,China
DOI:10.16157/j.issn.0258-7998.191085
Author:Lv Ying,Li Yinghua
Author Affilications:School of Information Engineering,Northwestern Polytechnical University Ming de College,Xi′an 710124,China
DOI:10.16157/j.issn.0258-7998.190828
Author:Chen Zhixin,Dong Ruixue,Liu Xin,Wang Yibin,Liang Shixiao
Author Affilications:Beijing Wuzi University,Beijing 101149,China
DOI:10.16157/j.issn.0258-7998.190901
Author:Li Jinming,Liu Mengxin,Cheng Naipeng
Author Affilications:School of Instrument and Electronics,North University of China,Taiyuan 030051,China
DOI:10.16157/j.issn.0258-7998.190940
Author:Jia Hongmin,Zhang Liguang,Dan Jianchao
Author Affilications:College of Electronic Information Engineering,Xi′an Technological University,Xi′an 710021,China
DOI:10.16157/j.issn.0258-7998.190857
Author:Zhao Jie1,2,3,Yang Junxian1,2,3,Hui Li1,2,3,Wang Zhi1,2,3,Chu Shibo1,2,3
Author Affilications:1.Institute of Oceanographic Instrmentation,Qilu University of Technology(Shandong Academy of Sciences),Qingdao 266061,China; 2.Shandong Provincial Key Laboratory of Ocean Enviromental Monitoring Techno1ogy,Qingdao 266061,China; 3.National Engineering and Technological Research Center of Marine Monitoring Equipment,Qingdao 266061,China
DOI:10.16157/j.issn.0258-7998.190911
Author:Zhang Huaqiang,Li Kaihang,Wang Jigang
Author Affilications:Chengdu R&D Center of ZTE Corporation,Chengdu 610041,China
DOI:10.16157/j.issn.0258-7998.191120
Author:Hu Tieqiao,Han Bin
Author Affilications:Intelligent Signal and Image Processing Key Lab of Tianjin,Civil Aviation University of China,Tianjin 300300,China
DOI:10.16157/j.issn.0258-7998.191263
Author:Hu Chunsheng1,Xiu Rui2,Wang De1
Author Affilications:1.School of Mechanical Engineering,Ningxia University,Yinchuan 750021,China; 2.The 21st Research Institute of CETC,Shanghai 200233,China
DOI:10.16157/j.issn.0258-7998.191239
Author:Wang Shuai,Xue Hanhan
Author Affilications:The 713th Research Institute of China Shipbuilding Industry Corporation,Zhengzhou 450015,China
DOI:10.16157/j.issn.0258-7998.191196
Author:Chen Hui1,Sun Yukun1,Yang Ting2,Huang Yonghong1
Author Affilications:1.School of Electrical and Information Engineering,Jiangsu University,Zhenjiang 212013,China; 2.School of Electric Power Engineering,Nanjing Institute of Technology,Nanjing 211167,China
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