DOI:10.16157/j.issn.0258-7998.200283
Author:Yang Xin1,2,Li Linqian3,Wei Bing3
Author Affilications:1.College of Big Data and Information Engineering,Guizhou University,Guiyang 550025,China; 2.Engineering Research Center of Semiconductor Power Device Reliability,Ministry of Education,Guiyang 550025,China; 3.School of Physics and Optoelectronic Engineering,Xidian University,Xi′an 710071,China
DOI:10.16157/j.issn.0258-7998.200264
Author:Li He,Liang Kun,Liu Min,He Ying,Zhang Hui
Author Affilications:China Electronics Technology Group Corporation No.58 Research Institute,Wuxi 214072,China
DOI:10.16157/j.issn.0258-7998.200302
Author:Peng Lin,Li Jiajin,Liang Zhaoming,Zhang Guohao
Author Affilications:School of Information Engineering,Guangdong University of Technology,Guangzhou 510006,China
DOI:10.16157/j.issn.0258-7998.200135
Author:Li Xiaofeng,Peng Lin
Author Affilications:School of Information and Communication,Guilin University of Electronic Technology,Guilin 541004,China
DOI:10.16157/j.issn.0258-7998.191221
Author:Dong Liang,Wei Ming
Author Affilications:No.36 Research Institute of CETC,Jiaxing 314033,China
DOI:10.16157/j.issn.0258-7998.200582
Author:Wang Yongsen1,Jin Chao2,Han Lei2
Author Affilications:1.China Telecom Corporation Limited Zhejiang Branch,Hangzhou 310000,China; 2.Huaxin Consulting Design & Research Institute Co.,Ltd.,Hangzhou 310026,China
DOI:10.16157/j.issn.0258-7998.200584
Author:Li Yifeng,Jin Chao,Tao Xin
Author Affilications:Huaxin Consulting Design & Research Institute Co.,Ltd.,Hangzhou 310026,China
DOI:10.16157/j.issn.0258-7998.200188
Author:Chen Yu,Shen Jianjun
Author Affilications:China Telecom Research Institute,Guangzhou 510630,China
DOI:10.16157/j.issn.0258-7998.200478
Author:Tan Rumeng1,Xiong Shangkun1,Wu Tong2
Author Affilications:1.Mobile Communication Institute,China Telecom Research Institute,Guangzhou 510630,China; 2.Center for Advanced Metering Infrastructure,National Institute of Metrology,Beijing 100029,China
DOI:10.16157/j.issn.0258-7998.200583
Author:Jin Chao,Xu Xisheng
Author Affilications:Huaxin Consulting Design & Research Institute Co.,Ltd.,Hangzhou 310026,China
DOI:10.16157/j.issn.0258-7998.200306
Author:Ge Wenshuang,Zheng Hefang,Liu Tianlong,Ma Zhao,Zhang Ruiquan,Wu Chengsheng
Author Affilications:The 6th Research Institute of China Electronics Corporation,Beijing 100083,China
DOI:10.16157/j.issn.0258-7998.209801
Author:Bian Shaoxian1,Micheal Feng1,David Yue1,Luan Xiaokun1,Cai Zhun2,Jiang Jianfeng1
Author Affilications:1.Tianjin Phytium Technology Co.,Ltd.,Changsha 410000,China;2.Cadence Design Systems,Inc.,Shanghai 202014,China
DOI:10.16157/j.issn.0258-7998.209803
Author:Zeng Jinwei
Author Affilications:Sanechips Technology Co.,Ltd.,Chengdu 610041,China
DOI:10.16157/j.issn.0258-7998.209802
Author:Zhang Yanwei1,Si Qiang1,Lv Zhijun2
Author Affilications:1.Beijing Zhaoxin Electronic Technology Co.,Ltd.,Beijing 100094,China 2.Cadence Design Systems,Inc.,Beijing 100013,China
DOI:10.16157/j.issn.0258-7998.209804
Author:Lin Kaizhi,Zong Yanyan,Sun Long,Tian Minzheng,Ma Junchi
Author Affilications:Inspur Electronic Information Industry Co.,Ltd.,Jinan 250101,China
DOI:10.16157/j.issn.0258-7998.209805
Author:Fan Junjian1,Chao Zhanghu1,Yang Qingna1,Liu Qi1,Zhu Hong1,Shan Jianqi2
Author Affilications:1.Tianjin Phytium Technology Co.,Ltd.,Tianjin 102209,China;2.Cadence,Shenzhen 518040,China
DOI:10.16157/j.issn.0258-7998.200189
Author:Hao Qiangyu,Wang Riyan,Zhou Lingli,He Hongyin
Author Affilications:Guangzhou Runxin Information Technology Co.,Ltd.,Guangzhou 510700,China
DOI:10.16157/j.issn.0258-7998.209806
Author:Hao Qiang
Author Affilications:Shanghai Hi-Performance IC Design Center,Shanghai 201204,China
DOI:10.16157/j.issn.0258-7998.200043
Author:Lv Sihong,Feng Quanyuan
Author Affilications:Institute of Microelectronics,Southwest Jiaotong University,Chengdu 611756,China
DOI:10.16157/j.issn.0258-7998.191125
Author:Wen Ke,Zhu Zheng,Ma Minshu
Author Affilications:Sichuan Institute of Solid-State Circuits, China Electronics Technology Group Corp,Chongqing 400060,China
DOI:10.16157/j.issn.0258-7998.191343
Author:He Linfei,Li Xiaofei,Han Junbo
Author Affilications:Tianjin Xunlian Technology Co.,Ltd.,Tianjin 300000,China
DOI:10.16157/j.issn.0258-7998.200113
Author:Yan Wei,Shen Bin,Liu Xiaoxiao
Author Affilications:School of Communication and Information Engineering,Chongqing University of Posts and Telecommunications, Chongqing 400065,China
DOI:10.16157/j.issn.0258-7998.191316
Author:Chen Xi1,2,Jiang Yaguang2,Li Jianbin3,Yan Jingchen3,Liu Shuyuan4,Li Kunchang3
Author Affilications:1.School of Software & Microelectronics,Peking University,Beijing 102600,China; 2.Department of CSTC in Network Security Inspection and Evaluation of Industrial Control System,Beijing 100044,China; 3.School of Control and Computer Engineering,North China Electric Power University,Beijing 100026,China; 4.Beijing Huadian TianRen Electric Power Control Technology Company Limited,Beijing 100039,China
DOI:10.16157/j.issn.0258-7998.191225
Author:Chen Bingrong1,Zhang Yanhua1,Sun Enchang1,Li Meng1,Yang Kui2
Author Affilications:1.Faculty of Information Technology,Beijing University of Technology,Beijing 100124,China; 2.Unicom Systems Integration Co.,Ltd.,Beijing 100176,China
DOI:10.16157/j.issn.0258-7998.190737
Author:He Jia1,Xi Zhenghao1,2,Kan Xiu1
Author Affilications:1.School of Electronic and Electrical Engineering,Shanghai University of Engineering Science,Shanghai 201620,China; 2.State Key Laboratory of Intelligent Technology and Systems,Department of Computer Science,Tsinghua University, Beijing 100091,China
DOI:10.16157/j.issn.0258-7998.191324
Author:Huang Mingxiang
Author Affilications:State Grid Fujian Electric Power Co.,LTD.,Construction Branch,Fuzhou 350012,China
DOI:10.16157/j.issn.0258-7998.200290
Author:Qian Hongwen,Wang Yi,Liu Hui
Author Affilications:China Electronics Technology Group Corporation No.58 Research Institute,Wuxi 214072,China
DOI:10.16157/j.issn.0258-7998.200027
Author:Chen Xuefei,Zhang Hongsheng,Wang Guoyu
Author Affilications:College of Electronic Engineering,Chongqing University of Posts and Telecommunications,Chongqing 400065,China
DOI:10.16157/j.issn.0258-7998.200341
Author:Wang Songming
Author Affilications:Southwest China Institute of Electronic Technology,Chengdu 610036,China
DOI:10.16157/j.issn.0258-7998.200259
Author:Hao Guofeng,Zhu Chen,Gu Xiaoxue
Author Affilications:China Electronics Technology Group Corporation No.58 Research Institute,Wuxi 214072,China
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