DOI:10.16157/j.issn.0258-7998.201068
Author:Zhang Guangxian
Author Affilications:The 13th Research Institute,CETC,Shijiazhuang 050051,China
DOI:10.16157/j.issn.0258-7998.200903
Author:Zhang Xiaoqing,Liu Dexi,Zhu Dalong,Shi Lei,Liu Yawei
Author Affilications:Beijing Research Institute of Telemetry,Beijing 100094,China
DOI:10.16157/j.issn.0258-7998.200870
Author:Qing Chen
Author Affilications:Southwest China Institute of Electronic Technology,Chengdu 610036,China
DOI:10.16157/j.issn.0258-7998.200891
Author:Sun Nan1,2,Wen Zhiguo1,2,Jiang Fan1,2,Li Yan1,2,Wang Yujing1,2,Zou Jian1,2,Song Ya1,2
Author Affilications:1.State Grid Key Laboratory of Power Industrial Chip Design and Analysis Technology, Beijing Smart-Chip Microelectronics Technology Co.,Ltd.,Beijing 100192,China; 2.Beijing Engineering Research Center of High-reliability IC with Power Industrial Grade, Beijing Smart-Chip Microelectronics Technology Co.,Ltd.,Beijing 100192,China
DOI:10.16157/j.issn.0258-7998.200512
Author:Xiong Qian1,Ma Kui1,2,Yang Fashun1,2
Author Affilications:1.College of Big Data and Information Engineering,Guizhou University,Guiyang 550025,Chnia; 2.Semiconductor Power Device Reliability Engineering Research Center of Ministry of Education,Guiyang 550025,China
DOI:10.16157/j.issn.0258-7998.200470
Author:Sun Desheng
Author Affilications:Shenzhen Smarter World Technology Co.,Ltd.,Shenzhen 518133,China
DOI:10.16157/j.issn.0258-7998.200555
Author:Chen Li1,2,Liu Yanyan1,2
Author Affilications:1.Key Laboratory for Photoelectronic Thin Film Devices and Technology of Tianjin,Nankai University,Tianjin 300350,China; 2.Engineering Research Center of Thin Film Optoelectronics Technology,Ministry of Education,Nankai University, Tianjin 300350,China
DOI:10.16157/j.issn.0258-7998.200868
Author:Wang Yongfeng,Bu Gang
Author Affilications:School of Electronic Information Engineering,Nanjing University of Aeronautics and Astronautics,Nanjing 211106,China
DOI:10.16157/j.issn.0258-7998.200825
Author:Zhang Mengwen1,2,Jin Yufeng1
Author Affilications:1.Peking University Shenzhen Graduate School,Shenzhen 518055,China;2.Goodix Technology Co.,Shenzhen 518045,China
DOI:10.16157/j.issn.0258-7998.200552
Author:Shen Hua,Zhen Haohan,Tong Tao,Shen Peigang,Chen Haimin,Chen Shengze
Author Affilications:Institute of Electric Power Science,State Grid Shanghai Electric Power Company,Shanghai 200090,China
DOI:10.16157/j.issn.0258-7998.200245
Author:Pang Xiaodong
Author Affilications:The First Research Institute of Ministry of Public Security,Beijing 102200,China
DOI:10.16157/j.issn.0258-7998.200285
Author:Duan Xiaomeng1,Luo Ranran1,Guo Qingying1,Ji Yuntao1,Xu Tao2
Author Affilications:1.China Electric Power Research Institute,Beijing 100192,China; 2.State Grid Zhejiang Electric Power Co.,Ltd.,Hangzhou 310007,China
DOI:10.16157/j.issn.0258-7998.200749
Author:Chi Wensheng1,2,Yuan Dan1,Xiao Zonghao3
Author Affilications:1.Equipment Management and UAV Engineering College,Air Force Engineering University,Xi′an 710051,China; 2.College of Electromechanical Engineering,Xidian University,Xi′an 710071,China; 3.Graduate College,Air Force Engineering University,Xi′an 710051,China
DOI:10.16157/j.issn.0258-7998.200388
Author:Lu Haipeng,Su Aimin,Wang Junfeng,Chen Ming
Author Affilications:ESIM Technology Ltd.,Shanghai 201206,China
DOI:10.16157/j.issn.0258-7998.200218
Author:Zhao Yueqi1,2,Zhao Dezheng2,Lin Hao2,Huo Yuxian2,Zhang Han1,2,Jia Shujuan1
Author Affilications:1.National Computer System Engineering Research Institute of China,Beijing 100083,China; 2.Intelligence Technology of CEC Co.,Ltd.,Beijing 100083,China
DOI:10.16157/j.issn.0258-7998.200179
Author:Jin Shanghe1,Zhang Yu1,2,Wang Yufei1,Shi Shanshan2,Wang Haojing2
Author Affilications:1.Shanghai University of Electric Power,Shanghai 200090,China; 2.State Grid Shanghai Electric Power Research Institute,Shanghai 200437,China
DOI:10.16157/j.issn.0258-7998.191286
Author:Ma Laibin,Ma Weifeng,Lou Jiao,Ji Caoting
Author Affilications:School of Information and Electronic Engineering,Zhejiang University of Science and Technology,Hangzhou 310023,China
DOI:10.16157/j.issn.0258-7998.191338
Author:Li Qiang,Wei Min,Li Gang,Wang Xing
Author Affilications:School of Automation and Information Engineering,Xi′an University of Technology,Xi′an 710048,China
DOI:10.16157/j.issn.0258-7998.200612
Author:Li Jintao1,Ren Yongfeng1,2,Yang Zhiwen1,Li Huijing1
Author Affilications:1.State Key Laboratory of Electronic Tecchnology,North University of China,Taiyuan 030051,China; 2.Key Laboratory of Instrument Science and Dynamic Testing(Ministry of Education) North University of China,Taiyuan 030051,China
DOI:10.16157/j.issn.0258-7998.200781
Author:Pei Hanhua,Qin Huibin
Author Affilications:Institute of New Electron Device & Application,Hangzhou Dianzi University,Hangzhou 310018,China
DOI:10.16157/j.issn.0258-7998.200734
Author:Fu Guie1,2,Xu Shengnan1,Miao Yu2,Zhang Yijin2
Author Affilications:1.School of Electronic and Optical Engineering,Nanjing University of Science and Technology,Nanjing 210094,China; 2.Nanjing Ruihe Electronics Co.,Ltd.,Nanjing 210094,China
DOI:10.16157/j.issn.0258-7998.200753
Author:Li Jingwei,Xin Qing,Yu Jie,Hou Changlun
Author Affilications:College of Electronic Information,Hangzhou Dianzi University,Hangzhou 310000,China
DOI:10.16157/j.issn.0258-7998.200585
Author:Pan Kai,Chen Xiao
Author Affilications:National Defense Key Discipline Laboratory of Communication and Information Transmission and Fusion Technology, Hangzhou Dianzi University,Hangzhou 310018,China
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