DOI:10.16157/j.issn.0258-7998.222944
Author:Chen Ruidong,Qin Huibin,Liu Wei
Author Affilications:Institute of New Electron Device and Application, School of Electronic Information , Hangzhou Dianzi University ,Hangzhou 310018, China
DOI:10.16157/j.issn.0258-7998.222900
Author:Du Tingting,Zhong Guoyun,Jiang Jinmao,Ren Weimin
Author Affilications:School of Information Engineering, East China University of Technology, Nanchang 330013, China)
DOI:10.16157/j.issn.0258-7998.223094
Author:Ye Rong,Shao Jianfei,Zhang Xiaowei,Shao Jianlong
Author Affilications:School of Information Engineering and Automation, Kunming University of Science and Technology, Kunming 650500, China
DOI:10.16157/j.issn.0258-7998.222891
Author:Fang Zhen,Zhao Wei,Liu Yong
Author Affilications:No.58 Research Institute of China Electronics Technology Gruop Corporation,Wuxi 214035,China
DOI:10.16157/j.issn.0258-7998.222892
Author:Shen Jing,Tao Qingping,Qiang Xiaoyan
Author Affilications:NO.58 Rerearch Institute of China Electronics Technology Group Corporation, Wuxi 214035,China
DOI:10.16157/j.issn.0258-7998.222872
Author:Xu Qinghao,Xi Dongjie
Author Affilications:No. 58 Research Institue of China Electronics Technology Group Corporation, Wuxi 214035, China
DOI:10.16157/j.issn.0258-7998.222961
Author:Yan Ying1,Cao Yusheng1,Zhang Rui2
Author Affilications:1.Shanghai Feiju Microelectronic Corporation, Shanghai 201316,China; 2.School of Micro-Nano Electronics, Zhejiang University, Hangzhou 310014,China)
DOI:10.16157/j.issn.0258-7998.222962
Author:Wang Feng,Wang Lei,Zhang Lirong
Author Affilications:Xi′an R&D Institute, New H3C Semiconductor, Xi′an 710075, China)
DOI:10.16157/j.issn.0258-7998.222953
Author:Liu Wei,Qin Huibin
Author Affilications:Institute of New Electron Device and Application,Hangzhou Dianzi University,Hangzhou 310018,China
DOI:10.16157/j.issn.0258-7998.222952
Author:Jiang Qingsong,Zhang Zhijie
Author Affilications:Key Laboratory of Instrumentation Science & Dynamic Measurement Ministry of Education, North University of China, Taiyuan 030051, China
DOI:10.16157/j.issn.0258-7998.223057
Author:Du Guangbo1,Cai Mao2,Zhang Xin2,Fan Xingming2,Cheng Jianghua1
Author Affilications:1.China United Engineering Corporation Limited, Hangzhou 310052, China; 2.Dep.of Electrical Engineering & Automation, Guilin University of Electronic and Technology ,Guilin 541004, China
DOI:10.16157/j.issn.0258-7998.223278
Author:Peng Sheng1,Zhao Jianbao2,Wei Minjie3
Author Affilications:1.College of Electronic Information Engineering,Shanghai University of Electric Power, Shanghai 201306, China; 2.State Grid Information and Telecommunication Group Co., Ltd., Beijing 102200, China; 3.College of Electrical Engineering,Shanghai University of Electric Power, Shanghai 201306, China
DOI:10.16157/j.issn.0258-7998.223052
Author:Xie Jia,Zhang Linghua
Author Affilications:School of Communication and Information Engineering,Nanjing University of Posts and Telecommunications,Nanjing 210023,China
DOI:10.16157/j.issn.0258-7998.222625
Author:Du Chao,Zhou Gan,Liu Guicong,Jiao Xiang,Nie Dianhui
Author Affilications:National Computer System Engineering Research Institute of China, Beijing 100083, China
DOI:10.16157/j.issn.0258-7998.222554
Author:Chen Hong1,Chen Chuandong1,2,Wei Rongshan1
Author Affilications:1.School of College and Information Engineering, Fuzhou University, Fuzhou 350108, China; 2.Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou 350108, China
DOI:10.16157/j.issn.0258-7998.222624
Author:Huang Bing,Wu Yunfeng,Zhang Kaixin,Han Qingmin,Zhang Jiufa,Chai Chuchu
Author Affilications:National Computer System Engineering Research Institute of China, Beijing 100083, China
DOI:10.16157/j.issn.0258-79982.222698
Author:Ding Zhaohui,Zhang Wei,Yang Guoyu,Liu Teng
Author Affilications:China Datang Group Science and Technology Research Institute Co., Ltd., Beijing 100043, China
DOI:10.16157/j.issn.0258-7998.222844
Author:Wang Yuqin1,Wang Xin2,Liu Baoqiang1,Li Yi1,Hong Sheng3
Author Affilications:1.Jiangsu Automation Research Institute, Lianyungang 222000, China; 2.Unit 32381 of the Chinese People′s Liberation Army, Beijing 100000, China; 3.School of Cyber Science and Technology, Beihang University, Beijing 100191, China
DOI:10.16157/j.issn.0258-7998.222741
Author:Wang Xingyu1,Hu Yanhai1,Xu Jianlei2,Chen Haihui2
Author Affilications:1.School of Mechanical Engineering and Mechanics, Ningbo University, Ningbo 315211,China; 2.Ningbo Hanggong Intelligent Equipment Co., Ltd., Ningbo 315311,China
DOI:10.16157/j.issn.0258-7998.222949
Author:Sun Ao,Qin Xujun
Author Affilications:47th Research Institute of China Electronics Technology Group Corporation, Shenyang 110000, China
DOI:10.16157/j.issn.0258-7998.222882
Author:Yu Xiaolin1,Zhang Chong1,Yin Wengang1,Qin Ling2
Author Affilications:1.Department of Information and Communication, Officers College of PAP, Chengdu 610213, China; 2.Xi'an Xiangxun Technology Co., Ltd., Xi'an 710000, China
DOI:10.16157/j.issn.0258-7998.222857
Author:Xue Pei1,Guan Jian1,Shao Chunwei2,Zhang Xingang1,Zheng Sixu1
Author Affilications:1.Wuxi Hope Microelectronics Co., Ltd.,Wuxi 214000, China; 2.No.58 Research Institute of China Electronics Technology Group Corporation, Wuxi 214000, China
DOI:10.16157/j.issn.0258-7998.222975
Author:Pang Yu1,Wei Dong1,Wang Junchao2
Author Affilications:1.Photoelectronic Information Sensing and Transmission Technology Laboratory,Chongqing University of Posts and Telecommunications,Chongqing 400065,China;2.School of Microelectronics and Communication Engineering,Chongqing University,Chongqing 400044,China)
DOI:10.16157/j.issn.0258-7998.222935
Author:Ji Ping,Xu Xiaoming,Zhu Guoling,Ji Zhenkai
Author Affilications:Wuxi East Technologies Inc., Wuxi 214072, China
DOI:10.16157/j.issn.0258-7998.222927
Author:Liu Shangming1,2,Cao Ping1,2,Li Chao1,2,Wang Xiaohu1,2
Author Affilications:1.State Key Laboratory of Particle Detection and Electronics, University of Science and Technology of China, Hefei 230026, China;2.Department of Modern Physics, University of Science and Technology of China, Hefei 230026, China
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