DOI:10.16157/j.issn.0258-7998.2017.07.001
Author:Duan Weiqian,Hu Anyong,Miao Jungang
Author Affilications:Key Laboratory of Microwave Sensing and Security Applications,Beijing University of Aeronautics and Astronautics, Beijing 100191,China
DOI:10.16157/j.issn.0258-7998.2017.07.002
Author:Wang Haoquan1,2,3,Guo Hao1,2,3,Hao Mingli1,2
Author Affilications:1.Beijing Key Laboratory of Radio Frequency IC Technology for Next Generation Communications, Institute of Microelectronics of Chinese Academy of Sciences,Beijing 100029,China; 2.R&D Center of HealthCare Electronics,Institute of Microelectronics of Chinese Academy of Sciences,Beijing 100029,China; 3.School of Electronic,Electrical and Communication Engineering,University of Chinese Academy of Sciences,Beijing 101400,China
DOI:10.16157/j.issn.0258-7998.2017.07.003
Author:Lin Bin1,You Baiqiang2
Author Affilications:1.School of Information Science and Technology,Xiamen University Tan Kah Kee College,Zhangzhou 363105,China; 2.School of Information Science and Technology,Xiamen University,Xiamen 361005,China
DOI:10.16157/j.issn.0258-7998.2017.07.004
Author:Chen Siming1,2,Zhang Xuelei1
Author Affilications:1.High Magnetic Field Laboratory of the Chinese Academy of Sciences,Hefei 230000,China; 2.University of Science and Technology of China,Hefei 230000,China
DOI:10.16157/j.issn.0258-7998.2017.07.005
Author:Xin Xin,Wang Chao,Hu Anyong,Miao Jungang
Author Affilications:Beijing Key Laboratory of Microwave Perception and Security Applications,Beijing University of Aeronautics and Astronautics, Beijing 100191,China
DOI:10.16157/j.issn.0258-7998.2017.07.006
Author:Wang Qianzhu,Qiu Congcong,Huang Deling
Author Affilications:School of Communications and Information Engineering,Chongqing University of Posts and Telecommunications, Chongqing 400065,China
DOI:10.16157/j.issn.0258-7998.2017.07.007
Author:Wang Min1,2,Liu Ying3,Shao Jin1,2,Hu Xiaobo1,2,Liu Liang1,2,Zhao Dongyan1,2,Zhang Haifeng1,2,Yin Guolong1,4
Author Affilications:1.Beijing Smartchip Microelectronics Technology Company Limited,Key Laboratory of State Grid Corporation, Laboratory of Power Chip Design and Analysis,Beijing 100192,China; 2.Beijing Smartchip Microelectronics Technology Company Limited, High-reliability IC Design Engineering Technology Research Center of Beijing Power,Beijing 100192,China; 3.The Ministry of Information and Communication of State Grid Corporation,Beijing 100088,China; 4.The State Grid Ningxia Electric Power Company,Yinchuan 750001,China
DOI:10.16157/j.issn.0258-7998.2017.07.008
Author:Zhang Dingding1,2,3,Zhang Zhaofeng1,3,Liao Youchun1,2
Author Affilications:1.Shanghai Advanced Research Institute,Chinese Academy of Sciences,Shanghai 201210,China; 2.University of Chinese Academy of Science,Beijing 100049,China; 3.ShanghaiTech University,Shanghai 201210,China
DOI:10.16157/j.issn.0258-7998.2017.07.009
Author:Hou Xuxu1,Ma Songling1,Sun Chen2,Guo Zijing1
Author Affilications:1.Mechanical & Electrical Engineering College,Xi′an University of Architecture and Technology,Xi′an 710055,China; 2.Xi′an Institute of Optics and Precision Mechanics,Chinese Academy of Sciences,Xi′an 710119,China
DOI:10.16157/j.issn.0258-7998.2017.07.010
Author:Kong Lingrong
Author Affilications:Invengo Information Technology Co.,Ltd.,Shenzhen 518057,China
DOI:10.16157/j.issn.0258-7998.2017.07.011
Author:Liu Hong,Ye Qiang
Author Affilications:College of Information Engineering,China Jiliang University,Hangzhou 310018,China
DOI:10.16157/j.issn.0258-7998.2017.07.012
Author:Li Yang
Author Affilications:AcconSys Technology Co.,Ltd,Beijing 100045,China
DOI:10.16157/j.issn.0258-7998.2017.07.013
Author:Yao Wang,Jin Hongxin,Zhao Pengfei,Cong Yanchao,Wang Xue
Author Affilications:China Academy of Launch Vehicle Technology,Beijing 100076,China
DOI:10.16157/j.issn.0258-7998.2017.07.014
Author:Hu Weiwei1,Wang Yihuai1,Zhang Yong2
Author Affilications:1.College of Computer Science and Technology,Soochow University,Suzhou 215006,China; 2.Suzhou Huaxiang Information Technology Company,Suzhou 215006,China
DOI:10.16157/j.issn.0258-7998.2017.07.015
Author:Liu Chaoyong1,Wang Suichao2,Zheng Xiancheng2
Author Affilications:1.Shanghai Aircraft Design and Research Institute,Shanghai 201210,China; 2.School of Automation,Northwestern Polytechnical University,Xi′an 710000,China
DOI:10.16157/j.issn.0258-7998.2017.07.016
Author:Zhao Yudong,Qin Honglei,Zhang Runping
Author Affilications:School of Electronic Information Engineering,Beihang University,Beijing 100191,China
DOI:10.16157/j.issn.0258-7998.2017.07.017
Author:Fang Dechuang1,Zhang Lei2,Wang Lutao1
Author Affilications:1.School of Computer Science,Chengdu University of Information Technology,Chengdu 610225,China; 2.Defense Key Subject Laboratory of Aero and Ground Laser Communication Technology, Changchun University of Science and Technology,Changchun 130022,China
DOI:10.16157/j.issn.0258-7998.2017.07.018
Author:Jiang Dongfang1,2,Ji Yuanfa1,2,Sun Xiyan1,2
Author Affilications:1.School of Information and Communication,Guilin University of Electronic Technology,Guilin 541004,China; 2.Guangxi Key Laboratory of Precision Navigation Technology and Application,Guilin 541004,China
DOI:10.16157/j.issn.0258-7998.2017.07.019
Author:Wang Cong1,2,3,Liu Qingquan1,2,3,Yang Jie4,Ding Renhui5
Author Affilications:1.Jiangsu Collaborative Innovation Center on Atmospheric Environment and Equipment Technology,Nanjing 210044,China; 2.College of Electronics and Information Engineering,Nanjing University of Information Science and Technology, Nanjing 210044,China; 3.Jiangsu Key Laboratory of Meteorological Observation and Signal Processing,Nanjing 210044,China; 4.School of Atmospheric Physics,Nanjing University of Information Science and Technology,Nanjing 210044,China; 5.Jiangsu Meteorological Observation Center,Nanjing 210009,China
DOI:10.16157/j.issn.0258-7998.2017.07.020
Author:Wang Zhongjie
Author Affilications:Chinees Flight Test Establishment,Yanliang 710089,China
DOI:10.16157/j.issn.0258-7998.2017.07.021
Author:Li Shenghui1,2,3,Lu Xiaodong2,Huang Chengjun2,3
Author Affilications:1.R&D Center of Healthcare Electronics,Institute of Microelectronics of Chinese Academy of Sciences,Beijing 100029,China; 2.Beijing Key Laboratory of Radio Frequency IC Technology for Next Generation Communications, Institute of Microelectronics of Chinese Academy of Sciences,Beijing 100029,China; 3.School of Future Technology,University of Chinese Academy of Sciences,Beijing 101400,China
DOI:10.16157/j.issn.0258-7998.2017.07.022
Author:Jiang Zhaojun1,Cheng Xiaogang2,Peng Yaqin3,Wang Jun1,Li Zhi2
Author Affilications:1.College of Automotive and Transportation,Wuxi Institute of Technology,Wuxi 214121,China; 2.Communication and Information Engineering,Nanjing University of Posts and Telecommunications,Nanjing 210003,China; 3.College of Computer Science and Engineering,Sanjiang University,Nanjing 210012,China
DOI:10.16157/j.issn.0258-7998.2017.07.023
Author:Li Guoqing1,2,Wei Jianchong1,2,Wang Zhijiong3,Gao Yueming1,2,Wei Mengyu2,3,Du Min1,2,Pan Shaoheng3
Author Affilications:1.College of Physics and Telecommunication Engineering,Fuzhou University,Fuzhou 350116,China; 2.Key Laboratory of Medical Instrumentation and Pharmaceutical Technology of Fujian Province,Fuzhou 350116,China; 3.Department of Electrical and Computer Engineering,Faculty of Science and Technology,University of Macau,Macao 999078,China
DOI:10.16157/j.issn.0258-7998.2017.07.024
Author:Meng Feng1,Xiao Zheng2,Liu Junyu3
Author Affilications:1.Shenhua Group Coal Production Department,Beijing 100011,China; 2.Shenhua Group Information Management Department,Beijing 100011,China; 3.Beijing Guodiantong Network Technology Co.,Ltd,Beijing 100011,China
DOI:10.16157/j.issn.0258-7998.2017.07.025
Author:Yan Wei1,2,Zhu Yan1
Author Affilications:1.National Space Science Center,Chinese Academy of Science,Beijing 100190,China; 2.University of Chinese Academy of Science,Beijing 100190,China
DOI:10.16157/j.issn.0258-7998.2017.07.026
Author:Chen Zhao,Mao Minghui,Chen Bin,Zhao Zhuoya
Author Affilications:Institute of Communication Engineering,China University of Geosciences,Wuhan 430074,China
DOI:10.16157/j.issn.0258-7998.2017.07.027
Author:Huang Junwei1,2,Zhou Pengguang1,Zhang Renchi1,Teng Deyang1,Xu Hao1
Author Affilications:1.School of Communication and Information Engineering,Chongqing University of Posts and Telecommunications, Chongqing 400065,China; 2.Key Lab of New Generation Broadband Mobile Communication Technology,Chongqing University of Posts and Telecommunications, Chongqing 400065,China
DOI:10.16157/j.issn.0258-7998.2017.07.028
Author:Yang Lu,Huang Kai,Yang Pinzhang
Author Affilications:Department of Communication and Information Engineering, Chongqing University of Posts and Telecommunication,Chongqing 400065,China
DOI:10.16157/j.issn.0258-7998.2017.07.029
Author:Zhu Yadong1,Gao Cuifang2
Author Affilications:1.Information Center,Jiangsu Union Technical Institute,Nanjing 211135,China; 2.School of Science,Jiangnan University,Wuxi 214112,China
DOI:10.16157/j.issn.0258-7998.2017.07.030
Author:Liu Qing,Huang Runan,Chen Yong,Li Jianpo,Zhao Delin
Author Affilications:College of Electrical Engineering,Yanshan University,Qinhuangdao 066004,China
DOI:10.16157/j.issn.0258-7998.2017.07.031
Author:Xiao Yuling1,Wu Zheng1,Zhu Yu2
Author Affilications:1.School of Architectural Engineering,Henan Vocational College of Applied Technology,Zhengzhou 450042,China; 2.School of Information Science and Engineering,East China University of Science and Technology,Shanghai 210040,China
DOI:10.16157/j.issn.0258-7998.2017.07.032
Author:Xie Changgui1,2,Chen Ping2
Author Affilications:1.School of Mechanical Engineering,Chongqing Vocational Institute of Engineering,Chongqing 402260,China; 2.School of Mechanical Engineering,Chongqing University,Chongqing 400044,China
DOI:10.16157/j.issn.0258-7998.2017.07.033
Author:Bai Yanyu1,Shen Chaoqun2,Yang Xinfeng3
Author Affilications:1.Department of Information Technology,College of Information & Business Zhongyuan University of Technology, Zhengzhou 451191,China; 2.Henan Mechanical and Electrical Vocational College,Zhengzhou 451191,China; 3.School of Computer and Information Engineering, Nanyang Institute of Technology,Nanyang 473004,China
DOI:10.16157/j.issn.0258-7998.2017.07.035
Author:Cui Chao,Li Hongmei,Zhang Hengguo,Cao Lingling
Author Affilications:School of Electrical Engineering and Automation,Hefei University of Technology,Hefei 230009,China
DOI:10.16157/j.issn.0258-7998.2017.07.034
Author:Yan Changguo1,Gong Renxi2,Liu Xiaoyong1
Author Affilications:1.School of Engineering and Technology,Zunyi Normal College,Zunyi 563006,China; 2.School of Electrical Engineering,Guangxi University,Nanning 530004,China
DOI:10.16157/j.issn.0258-7998.2017.07.036
Author:Song Minhui1,Fei Wei1,2,Liu Xiaoning2
Author Affilications:1.University of Science and Technology of China,Hefei 230026,China; 2.High Magnetic Field Laboratory of the Chinese Academy of Sciences,Hefei 230031,China
DOI:10.16157/j.issn.0258-7998.2017.07.037
Author:Tang Jianqiang,Zhou Fengxing,Shen Chunpeng
Author Affilications:School of Information Science and Engineering,Wuhan University of Science and Technology,Wuhan 430081,China
DOI:10.16157/j.issn.0258-7998.2017.07.038
Author:Chen Xiandong1,Cao Taiqiang1,2,Li Fansen1
Author Affilications:1.School of Electric Information,Xihua University,Chengdu 610039,China; 2.Key Laboratory of Fluid and Power Machinery(Xihua University),Ministry of Education,Chengdu 610039,China
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