DOI:10.16157/j.issn.0258-7998.179013
Author:Zhou Zhimei1,2,Zhao Dongyan1,2,Zhang Haifeng1,2,Du Jun1,2,Wang Weibin1,2
Author Affilications:1.State Grid Key Laboratory of Power Industrial Chip Design and Analysis Technology, Beijing Smart-Chip Microelectronics Technology Co.,Ltd.,Beijing 100192,China; 2.Beijing Engineering Research Center of High-Reliability IC with Power Industrial Grade, Beijing Smart-Chip Microelectronics Technology Co.,Ltd.,Beijing 100192,China
DOI:10.16157/j.issn.0258-7998.179014
Author:Cui Bingrong1,2,Liu Liang1,2,Gan Jie1,2,Zhang Haifeng1,Chen Lei1,2,Yin Guolong3
Author Affilications:1.State Grid Key Laboratory of Power Industrial Chip Design and Analysis Technology, Beijing Smart-Chip Microelectronics Technology Co.,Ltd.,Beijing 100192,China; 2.Beijing Engineering Research Center of High-reliablity IC with Power Industrial Grade, Beijing Smart-Chip Microelectronics Technology Co.,Ltd.,Beijing 100192,China; 3.State Grid Ningxia Electric Power Company,Yinchuan 750002,China
DOI:10.16157/j.issn.0258-7998.179015
Author:Zhou Chunliang1,2,Zhou Zhimei1,2,Yang Xiaoping1,2,Li Lu1,2,Feng Xi1,2,Tang Xiaoke1,2
Author Affilications:1.State Grid Key Laboratory of Power Industrial Chip Design and Analysis Technology, Beijing Smart-Chip Microelectronics Technology Co.,Ltd.,Beijing 100192,China; 2.Beijing Engineering Research Center of High-Reliability IC with Power Industrial Grade, Beijing Smart-Chip Microelectronics Technology Co.,Ltd.,Beijing 100192,China
DOI:10.16157/j.issn.0258-7998.179016
Author:Zhou Hanbing1,2,Zhao Dongyan1,2,Tang Xiaoke1,2,Zhang Haifeng1,2,Wang Dongshan1,2
Author Affilications:1.State Grid Key Laboratory of Power Industrial Chip Design and Analysis Technology, Beijing Smart-Chip Microelectronics Technology Co.Ltd.,Beijing 100192,China; 2.Beijing Engineering Research Center of High-reliability IC with Power Industrial Grade, Beijing Smart-Chip Microelectronics Technology Co.Ltd.,Beijing 100192,China
DOI:10.16157/j.issn.0258-7998.179017
Author:Li Zhenguo1,2,He Yang1,2,Hu Yi1,2,Wang Jinxiong1,2,Tang Xiaoke1,2,Yuan Yidong1,2,Li Yintao3,Yuan Weiguo3
Author Affilications:1.State Grid Key Laboratory of Power Industrial Chip Design and Analysis Technology, Beijing Smart-Chip Microelectronics Technology Co.,Ltd.,Beijing 100192,China; 2.Beijing Engineering Research Center of High-reliability IC with Power Industrial Grade, Beijing Smart-Chip Microelectronics Technology Co.,Ltd.,Beijing 100192,China; 3.State Grid Jibei Electric Power Company,Beijing 100053,China
DOI:10.16157/j.issn.0258-7998.171107
Author:Shen Sibo1,2,Wan Qiuhua1,Du Yingcai1,Zhao Changhai1,Sun Ying1
Author Affilications:1.Changchun Institute of Optics,Fine Mechanics and Physics,Chinese Academy of Sciences,Changchun 130033,China; 2.University of Chinese Academy of Sciences,Beijing 100049,China
DOI:10.16157/j.issn.0258-7998.171629
Author:Ke Zhibin,Ye Kun,Zhou Yuanyuan
Author Affilications:Fujian Witsi Microelectronics Technology Co.,Ltd.Fuzhou 350003,China
DOI:10.16157/j.issn.0258-7998.171271
Author:Wang Han,Cheng Cheng,Shi Jiaru
Author Affilications:Tsinghua University,Department of Engineering Physics,Beijing 100086,China
DOI:10.16157/j.issn.0258-7998.171048
Author:Liu Lu1,Xu Jinfu1,Li Wei1,2,Yang Yuhang1
Author Affilications:1.The PLA Information Engineering University,Zhengzhou 450001,China; 2.State Key Laboratory of Fudan University Specific Integrated Circuit and System,Shanghai 201203,China
DOI:10.16157/j.issn.0258-7998.170967
Author:Tan Kai1,Peng Duan2
Author Affilications:1.School of Information Engineering,Guangdong University of Technology,Guangzhou 510006,China; 2.Department of Experimental Teaching,Guangdong University of Technology,Guangzhou 510006,China
DOI:10.16157/j.issn.0258-7998.172185
Author:Zhao Lei1,2,Zhang Feng1
Author Affilications:1.Institute of Microelectronics of Chinese Academy of Sciences,Beijing 100029,China; 2.University of Chinese Academy,Beijing 100049,China
DOI:10.16157/j.issn.0258-7998.170893
Author:Zuo Zhengpu,Guo Haiyan,Liu Mingmin
Author Affilications:School of Information Technology,Southwest University of Science and Technology,Mianyang 621010,China
DOI:10.16157/j.issn.0258-7998.170747
Author:Zhang Qiangqing,Zhang Mengxiang,Zhang Xia,Hu Jianling
Author Affilications:School of Electronic and Information Engineering,Soochow University,Suzhou 215006,China
DOI:10.16157/j.issn.0258-7998.179018
Author:Feng Dajun1,Zhang Xiaoli1,Du Wenyu2,Xu Yifeng1,Ma Baoquan1
Author Affilications:1.National Computer System Engineering Research Institute of China,Beijing 100083,China; 2.The Supreme People′s Procuratorate,Beijing 100726,China
DOI:10.16157/j.issn.0258-7998.170392
Author:Duan Jianmin,Wang Changren,Ren Lu,Liu Dan
Author Affilications:Department of Information Science,Beijing University of Technology,Beijing 100124,China
DOI:10.16157/j.issn.0258-7998.171650
Author:Hou Yuhan,Wang Yaoli
Author Affilications:College of Information Engineering,Taiyuan University of Technology,Taiyuan 030024,China
DOI:10.16157/j.issn.0258-7998.171373
Author:Zhang Mengying,Zeng Cheng,Di Susu,Wang Yunrui
Author Affilications:School of Electronic and Information Engineering,Hebei University of Technolog,Tianjin 300400,China
DOI:10.16157/j.issn.0258-7998.170472
Author:Li Tonghui1,Duan Hongguang1,2,Tang Hong1,Liu Menglu1
Author Affilications:1.School of Communication and Information Engineering,Chongqing University of Posts and Telecommunications, Chongqing 400065,China; 2.Key Lab of New Generation Broadband Mobile Communication Technology,Chongqing University of Posts and Telecommunications, Chongqing 400065,China
DOI:10.16157/j.issn.0258-7998.179019
Author:Wang Yixuan,Feng Dajun,Wang Hao,Zhang Xiaoli
Author Affilications:National Computer System Engineering Research Institute of China,Beijing 100083,China
DOI:10.16157/j.issn.0258-7998.170281
Author:Xue Jianbin1,2,Liang Yanhui1
Author Affilications:1.School of Computer and Communication, Lanzhou University of Technology,Lanzhou 730050,China; 2.National Mobile Communications Research Laboratory,Southeast University,Nanjing 210096,China
DOI:10.16157/j.issn.0258-7998.170842
Author:Liu Xiaopeng1,Zhang Yunhua1,Chen Haitao2,Chen Ke1,Zhu Guoqiang1
Author Affilications:1.School of Electronic Information,Wuhan University,Wuhan 430072,China; 2.Antenna Research Department, Wuhan Maritime Communication Research Institute,Wuhan 430079,China
DOI:10.16157/j.issn.0258-7998.170127
Author:Chen Yong,Huang Ru′nan,Liu Qing,Li Jianpo,Li Xin
Author Affilications:College of Electrical Engineering,Yanshan University,Qinhuangdao 066004,China
DOI:10.16157/j.issn.0258-7998.170491
Author:Shen Haiqiang1,Yin Shenghua1,Wu Yingji2,Tang Lun1
Author Affilications:1.Key Laboratory of Mobile Communication Technology,Chongqing University of Posts and Telecommunications, Chongqing 400065,China; 2.School of Software Engineering,Chongqing University of Posts and Telecommunications,Chongqing 400065,China
DOI:10.16157/j.issn.0258-7998.170321
Author:Shi Lanjie1,Chen Haihua1,2
Author Affilications:1.College of Electronic Information and Optical Engineering,Nankai University,Tianjin 300350,China; 2.Tianjin Key Laboratory of Optoelectronic Sensor and Sensing Network Technology,Tianjin 300350,China
DOI:10.16157/j.issn.0258-7998.170367
Author:Zou Lihua1,Zhan Yinwei2
Author Affilications:1.Department of Computer Engineering,Dongguan Vocational and Technical College,Dongguan 523808,China; 2.School of Computer,Guangdong University of Technology,Guangzhou 510006,China
DOI:10.16157/j.issn.0258-7998.170114
Author:Shan Zhenhua,Wang Shujing,Qiang Jie
Author Affilications:School of Mechatronic Engineering and Automation,Shanghai University,Shanghai 200072,China
DOI:10.16157/j.issn.0258-7998.170338
Author:Zhang Xiqian1,Li Fenglian1,Zhang Xueying1,Tian Yuchu1,2
Author Affilications:1.College of Information Engineering,Taiyuan University of Technology,Jinzhong 030600,China; 2.School of Electrical Engineering and Computer Science,Queensland University of Technology,Brisbane QLD 4001,Australia
DOI:10.16157/j.issn.0258-7998.166220
Author:Jiang Xingguo1,2,Luo Zhenzhen1,Li Haiou1,2,Ou Shaomin3
Author Affilications:1.School of Information and Communication,Guilin University of Electronic Technology,Guilin 541004,China; 2.Guangxi Key Laboratory of Precision Navigation Technology and Application,Guilin University of Electronic Technology, Guilin 541004,China; 3.Institute of Information Technology,Guilin University of Electronic Technology,Guilin 541004,China
DOI:10.16157/j.issn.0258-7998.179020
Author:Wei Lindong,Huang Yongfeng
Author Affilications:Department of Electronic Engineering,Tsinghua University,Beijing 100084,China
DOI:10.16157/j.issn.0258-7998.166663
Author:Yu Mingyang,Pan Yongbing
Author Affilications:Central South University,School of Information Science and Engineering,Changsha 410075,China
DOI:10.16157/j.issn.0258-7998.170462
Author:Meng Yanjing,Jia Juanjuan,Ma Huihai,Wu Hui
Author Affilications:College of Electrical and Information Engineering,Shaanxi University of Science & Technology,Xi′an 710021,China
DOI:10.16157/j.issn.0258-7998.170462
Author:Shen Litao,Tao Xuehui,Yang Bin
Author Affilications:School of Urban Rail Transportation, Soochow University,Suzhou 215131,China
DOI:10.16157/j.issn.0258-7998.170462
Author:Dai Wentong,Mu Xianmin,Fan Yongsheng
Author Affilications:School of Electrical Engineering,Dalian University of technology,Dalian 116024,China
DOI:10.16157/j.issn.0258-7998.170929
Author:Zhang Lei,Jiang Huilin,Song Yansong,Tong Shoufeng
Author Affilications:Institute of Space Optoelectronic Technology,Changchun University of Science and Technology,Changchun 130022,China
DOI:10.16157/j.issn.0258-7998.170994
Author:Zhang Xiaohong,Hao Yukai
Author Affilications:AVIC Xi′an Aeronautic Computing Technique Research Institue,Xi′an 710115,China
DOI:10.16157/j.issn.0258-7998.171264
Author:Zhou Tianyuan1,2,Cao Libo2,Zhang Feitie2,Wu Menghua3
Author Affilications:1.DIAS Automotive Electronic Systems Co.,Ltd,Shanghai 201206,China; 2.State Key Laboratory of Advanced Design and Manufacturing for Vehicle body,Hunan University,Changsha 410082,China; 3.Pan Asia Technical Automotive Center Co.,Ltd,Shanghai 200120,China
DOI:10.16157/j.issn.0258-7998.170718
Author:Cheng Yu,Zhou Yinlong,Yuan Yan,Wang Zhifeng
Author Affilications:The Third Institute of CETC,Beijing 100015,China
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