DOI:10.16157/j.issn.0258-7998.181290
Author:Chang Wei1,Sun Xuehong2,3,Liu Liping1,3
Author Affilications:1.School of Physics and Electronic- Electrical Engineering,Ningxia University,Yinchuan 750021,China; 2.School of Information Engineering,Ningxia University,Yinchuan 750021,China; 3.Key Laboratory Intelligent Sensing for Desert Information,Yinchuan 750021,China
DOI:10.16157/j.issn.0258-7998.180908
Author:Cao Tuo,Fu Song,He Siyuan
Author Affilications:Electronic Information College,Wuhan University,Wuhan 430072,China
DOI:10.16157/j.issn.0258-7998.181478
Author:Wang Shuai,Wang Eryong
Author Affilications:School of Electrical Engineering and Automation,Henan Polytechnic University,Jiaozuo 454000,China
DOI:10.16157/j.issn.0258-7998.189012
Author:Xie Yongjun,Wang Zhengpeng,Miao Jungang,Wan Guolong
Author Affilications:Beijing Key Laboratory of Microwave Sensing and Security Applications,Beihang University,Beijing 100191,China
DOI:10.16157/j.issn.0258-7998.181080
Author:Rao Xiaohong1,Ni Piao2,Jin Haiyan3,Huang Tao3,Huang Yongmao3
Author Affilications:1.Department of Technology Research and Development,Chongqing Chuanyi Software Co.,Ltd.,Chongqing 401121,China; 2.School of Information Science and Technology,Chengdu University of Technology,Chengdu 610059,China; 3.School of Information and Communication Engineering,University of Electronic Science and Technology of China, Chengdu 611731,China
DOI:10.16157/j.issn.0258-7998.180398
Author:Ou Lixiang,Li Sizhen,Yu Kai,Zhang Guohao
Author Affilications:School of Information Engineering,Guangdong University of Technology,Guangzhou 510006,China
DOI:10.16157/j.issn.0258-7998.174395
Author:Hou Jiali1,2,3,Hu Yi1,2,3,He Yang1,2,3,Wang Xiaoman1,2,3,Yang Xiaokun1,2,3
Author Affilications:1.Beijing Smart-Chip Microelectronics Technology Co.,Ltd.,Beijing 100192,China; 2.State Grid Key Laboratory of Power Industrial Chip Design and Analysis Technology,Beijing 100192,China; 3.Beijing Engineering Research Center of High-reliability IC with Power Industrial Grade,Beijing 100192,China
DOI:10.16157/j.issn.0258-7998.174921
Author:Shi Chao,Qiao Zhaojie,Xu Liang,Gao Changzheng
Author Affilications:The 13th Research Institute,CETC,Shijiazhuang 050051,China
DOI:10.16157/j.issn.0258-7998.172821
Author:Wei Qidi1,Lin Junming1,Zhang Guohao1,Chen Liang2,3
Author Affilications:1.School of Information,Guangdong University of Technology,Guangzhou 510000,China; 2.The 55th Research Institute of China Electronics Technology Group Corporation,Nanjing 210000,China; 3.Nanjing Guobo Electronics Company Limited,Nanjing 210000,China
DOI:10.16157/j.issn.0258-7998.174272
Author:Zhao Jinglong,Miao Min
Author Affilications:Information Microsystem Institute,Beijing Information Science & Technology University,Beijing 100101,China
DOI:10.16157/j.issn.0258-7998.180233
Author:Li Shen1,Yan Wei2,Xia Jun1,Cui Zhengdong2,Chai Zhilei1
Author Affilications:1.School of Internet of Things Engineering,Jiangnan University,Wuxi 214122,China; 2.School of Software & Microelectronics,Peking University,Beijing 102600,China
DOI:10.16157/j.issn.0258-7998.174381
Author:Wang Chunxia1,Si Guobin1,Guo Yatao2
Author Affilications:1.Mechanical and Electrical Engineering,Jiaozuo University,Jiaozuo 454003,China; 2.State Grid Corporation of China,Wenxian Power Supply Company,Jiaozuo 454003,China
DOI:10.16157/j.issn.0258-7998.174988
Author:Yang Fan1,2,Wang Yihuai1,Song Hongru2,3
Author Affilications:1.School of Computer Science and Technology,Soochow University,Suzhou 215006,China; 2.College of Mathematics and Computer Science,Tongling University,Tongling 244000,China; 3.College of Electrical Engineering,Tongling University,Tongling 244000,China
DOI:10.16157/j.issn.0258-7998.175198
Author:Wu Mingbiao1,2,Wu Guiqing1,Chen Qinghua2
Author Affilications:1.College of Electrical and Information Engineering,Hunan University,Changsha 410082,China; 2.Insitute of Information Technology,Yangtze Delta Region Institute of Tsinghua University,Jiaxing 314006,China
DOI:10.16157/j.issn.0258-7998.175167
Author:Zhang Fengqi,Zhang Yanbin,Wang Zhongyong
Author Affilications:Industrial Technology Research Institute,Zhengzhou University,Zhengzhou 450000,China
DOI:10.16157/j.issn.0258-7998.175143
Author:Han Zaifeng1,Zhao Limin2
Author Affilications:1.Beijing System Control International Inc.,Beijing 100083,China; 2.College of Information Management,Dezhou University,Dezhou 253023,China
DOI:10.16157/j.issn.0258-7998.173065
Author:Qian Nixin,Zhu Yunfan,Shi Huan,Zhong Binbin,Wu Jinli,Wang Jie,Li Xiaolong
Author Affilications:School of Electronics and Information,Jiangsu University of Science and Technology,Zhenjiang 212003,China
DOI:10.16157/j.issn.0258-7998.180547
Author:Liu Bo,Yi Hui,Bo Cuimei,Zhuang Chengcheng
Author Affilications:College of Electrical Engineering & Control Science,Nanjing Tech University,Nanjing 211816,China
DOI:10.16157/j.issn.0258-7998.180295
Author:Xing Jinjin,Shao Hua,Liu Yunxiao
Author Affilications:Shanghai E-Propulsion Auto Technology Co.,Ltd.,Shanghai 201804,China
DOI:10.16157/j.issn.0258-7998.175175
Author:Zhou Luyang1,2,3,Hu Yigong2,Wu Yuanxin2,3
Author Affilications:1.School of Aeronautics and Astronautics,Central South University,Changsha 410083,China; 2.School of Electronic Information and Electrical Engineering,Shanghai Jiao Tong University,Shanghai 200240,China; 3.Shanghai Key Lab of Navigation and Location Services,Shanghai 200240,China
DOI:10.16157/j.issn.0258-7998.180229
Author:Zhu Jun
Author Affilications:School of Telecommunications,Hubei Radio & TV University,Wuhan 430074,China
DOI:10.16157/j.issn.0258-7998.175065
Author:Yu Haobo,Shan Yanhu,Ren Yongfeng,Jiao Xinquan
Author Affilications:National Key Laboratory For Electronic Measurement Technology,Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education,North University of China,Taiyuan 030051,China
DOI:10.16157/j.issn.0258-7998.174337
Author:Zhao Xu,Tang Lun,Liu Yunlong,Chen Qianbin
Author Affilications:Key Lab of Mobile Communication Technology,Chongqing University of Post and Telecommunications,Chongqing 400065,China
DOI:10.16157/j.issn.0258-7998.174511
Author:Gong Jianfeng1,Wu Weizu2,He Junlin3
Author Affilications:1.Department of Computer Engineering,Maoming Vocational Technical College,Maoming 525000,China; 2.School of Information,Guangdong Ocean University,Zhanjiang 524088,China; 3.School of Computer Sciences,Chengdu Normal University,Chengdu 611130,China
DOI:10.16157/j.issn.0258-7998.174327
Author:Xiong Wei1,2,Liu Xiaojing2,3
Author Affilications:1.Hubei Collaborative Innovation Center for High-efficiency Utilization of Solar Energy, Hubei University of Technology,Wuhan 430068,China; 2.School of Electrical and Electronic Engineering,Hubei University of Technology,Wuhan 430068,China; 3.Shenzhen Advanced Technology Research Institute,Chinese Academy of Sciences,Shenzhen 518000,China
DOI:10.16157/j.issn.0258-7998.174222
Author:Chen Fatang,Tang Cheng,Liu Yifan
Author Affilications:Chongqing Key Lab of Mobile Communication Technology,Chongqing University of Posts and Telecommunications, Chongqing 400065,China
DOI:10.16157/j.issn.0258-7998.174303
Author:Zhang Gang,Xu Xin
Author Affilications:School of Communication and Information Engineering,Chongqing University of Posts and Telecommunications, Chongqing 400065,China
DOI:10.16157/j.issn.0258-7998.174111
Author:Zhu Fei,Jing Weidong
Author Affilications:Department of Electrical Engineering,Southwest Jiaotong University,Chengdu 610031,China
DOI:10.16157/j.issn.0258-7998.174335
Author:Liu Buzhong1,2
Author Affilications:1.Engineering Technology Research and Development Center of Electronic Products of Small and Medium Enterprises of Jiangsu Province,Huai′an 223003,China; 2.Huaian Vocational College of Information Technology,Huai′an 223003,China
DOI:10.16157/j.issn.0258-7998.173957
Author:Wei Ting1,Huang Haisheng1,Li Xin1,Cao Xinliang2
Author Affilications:1.School of Electronic Engineering,Xi′an University of Posts and Telecommunications,Xi′an 710121,China; 2.School of Physics and Electronic Information,Yan′an University,Yan′an 716000,China
DOI:10.16157/j.issn.0258-7998.174086
Author:Hao Wei,Zhang Hongli
Author Affilications:School of Electrical Engineering,Xinjiang University,Urumchi 830047,China
DOI:10.16157/j.issn.0258-7998.173337
Author:Liang Guozhuang,Tian Hanlei
Author Affilications:School of Electrical Engineering,Hebei University of Science and Technology,Shijiazhuang 050018,China
DOI:10.16157/j.issn.0258-7998.173706
Author:Han Qi,Liu Songyang,Zhang Lijuan,Zhao Quanming
Author Affilications:School of Electronic Information Engineering,Hebei University of Technology,Tianjin 300401,China
DOI:10.16157/j.issn.0258-7998.175170
Author:Cao Zhenguan,Yu Junfeng,Li Zhiwei
Author Affilications:College of Electrical and Information Engineering,Anhui University of Science and Technology,Huainan 232001,China
DOI:10.16157/j.issn.0258-7998.173108
Author:Wu Yi,Li Qing,Shi Ge
Author Affilications:Institute of Mechanical and Electrical Engineering,China Jiliang University,Hangzhou 310018,China
DOI:10.16157/j.issn.0258-7998.173672
Author:Dai Wentong,Mu Xianmin,Liu Huasheng,Jiao Haikun
Author Affilications:School of Electrical Engineering,Dalian University of Technology,Dalian 116024,China
DOI:10.16157/j.issn.0258-7998.173399
Author:Yao Yueqin1,Lu Zhengkai2
Author Affilications:1.College of Mechanical and Electrical Engineering, Yancheng Industrial Vocational and Technical College,Yancheng 224005,China; 2.College of Automation, Northwestern Polytechnic University,Xi′an 710129,China
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